MLG0603PR10J TDK Corporation, MLG0603PR10J Datasheet - Page 18

• Manufacturer Part Number: MLG0603PR10J
• Description: INDUCTOR MULTILAYER 100NH 0201
• Manufacturer: TDK Corporation
• Series: MLGr
• Type: Ceramicr

Specifications of MLG0603PR10J

• Inductance: 100nH
• Current: 80mA
• Current - Saturation: -
• Current - Temperature Rise: -
• Tolerance: ± 5%
• Shielding: -
• Dc Resistance (dcr): 4.5 Ohm Max
• Q @ Freq: 9 @ 300MHz
• Frequency - Self Resonant: 1.3GHz
• Package / Case: 0201 (0603 Metric)
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 125°C
• Frequency - Test: 300MHz
• Material - Core: -
• Applications: High Frequency
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 445-7838-2

SMD Inductors(Coils)
For High Frequency(Multilayer)
MLG Series MLG1608
FEATURES
• Inductance values are supported from 1 to 1000nH.
• Advanced monolithic structure is formed using a multilayering
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
RECOMMENDED PC BOARD PATTERN
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application is considered the following:
• All specifications are subject to change without notice.
250 to 260˚C
230˚C
180˚C
150˚C
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
and sintering process with ceramic and conductive materials for
high-frequency.
soldering.
0.6
0.8
Preheating
60 to 120s
0.3±0.2
1.6±0.15
0.6
Time(s)
Dimensions in mm
Soldering
30 to 60s
10s max.
Natural
cooling
Weight: 4mg
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions
(3) Material code
(4) Inductance value
(5) Inductance tolerance
(6) Packaging style
SPECIFICATIONS
Operating temperature range
Storage temperature range
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
• After mounting components onto the printed circuit board, do not
• When hand soldering, apply the soldering iron to the printed
MLG 1608 B 2N2 S
(1)
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
apply stress through board bending or mishandling.
circuit board only. Temperature of the iron tip should not exceed
300°C. Soldering time should not exceed 3 seconds.
1608
2N2
12N
R10
1R0
S
D
J
T
(2)
(3) (4) (5) (6)
T
–55 to +125°C
–55 to +125°C
2.2nH
12nH
100nH
1000nH
±0.3nH
±0.5nH
±5%
Taping (reel)
1.6×0.8mm (L×W)
Quantity
4000 pieces/reel
Conformity to RoHS Directive
001-05 / 20110822 / e521_mlg
(17/20)