PSMN9R0-25YLC,115 NXP Semiconductors, PSMN9R0-25YLC,115 Datasheet - Page 2

MOSFET Power N-chnl25V9.1m logic lvl MOSFET in LFPAK

PSMN9R0-25YLC,115

Manufacturer Part Number
PSMN9R0-25YLC,115
Description
MOSFET Power N-chnl25V9.1m logic lvl MOSFET in LFPAK
Manufacturer
NXP Semiconductors
Datasheets

Specifications of PSMN9R0-25YLC,115

Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
9.1 mOhms
Drain-source Breakdown Voltage
25 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
46 A
Power Dissipation
34 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
LFPAK
Fall Time
5 ns
Gate Charge Qg
12 nC
Minimum Operating Temperature
- 55 C
Rise Time
10 ns
Lead Free Status / Rohs Status
 Details
NXP Semiconductors
2. Pinning information
Table 2.
3. Ordering information
Table 3.
4. Limiting values
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
PSMN9R0-25YLC
Product data sheet
Pin
1
2
3
4
mb
Type number
PSMN9R0-25YLC
Symbol
V
V
V
I
I
P
T
T
T
V
Source-drain diode
I
I
Avalanche ruggedness
E
D
DM
S
SM
stg
j
sld(M)
DS
DGR
GS
tot
ESD
DS(AL)S
Symbol Description
S
S
S
G
D
Pinning information
Ordering information
Limiting values
Parameter
drain-source voltage
drain-gate voltage
gate-source voltage
drain current
peak drain current
total power dissipation
storage temperature
junction temperature
peak soldering temperature
electrostatic discharge voltage
source current
peak source current
non-repetitive drain-source
avalanche energy
source
source
source
gate
mounting base; connected to drain
LFPAK; Power-SO8
Package
Name
N-channel 25 V 9.1 mΩ logic level MOSFET in LFPAK using NextPower technology
All information provided in this document is subject to legal disclaimers.
Description
plastic single-ended surface-mounted package; 4 leads
Rev. 2 — 1 November 2011
T
MM (JEDEC JESD22-A115)
Conditions
25 °C ≤ T
25 °C ≤ T
V
V
pulsed; t
see
T
pulsed; t
V
V
see
mb
mb
GS
GS
GS
sup
Figure 4
Figure 3
= 25 °C; see
= 25 °C
= 10 V; T
= 10 V; T
= 10 V; T
≤ 25 V; unclamped; R
Simplified outline
SOT669 (LFPAK; Power-SO8)
p
p
j
j
≤ 10 µs; T
≤ 10 µs; T
≤ 175 °C
≤ 175 °C; R
mb
mb
j(init)
= 25 °C; see
= 100 °C; see
Figure 2
= 25 °C; I
1 2 3 4
mb
mb
mb
GS
= 25 °C;
= 25 °C
= 20 kΩ
GS
D
= 46 A;
= 50 Ω;
Figure 1
PSMN9R0-25YLC
Figure 1
Graphic symbol
Min
-
-
-20
-
-
-
-
-55
-55
-
140
-
-
-
mbb076
G
© NXP B.V. 2011. All rights reserved.
SOT669
175
175
-
Version
Max
25
25
20
46
32
183
34
260
31
183
10
D
S
Unit
V
V
V
A
A
A
W
°C
°C
°C
V
A
A
mJ
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