5962-9151901MPA Analog Devices Inc, 5962-9151901MPA Datasheet - Page 6

• Manufacturer Part Number: 5962-9151901MPA
• Manufacturer: Analog Devices Inc
• Type: General Purpose Amplifierr

Specifications of 5962-9151901MPA

• Rail/rail I/o Type: No
• Number Of Elements: 2
• Unity Gain Bandwidth Product: 4.7MHz
• Slew Rate: 22V/us
• Common Mode Rejection Ratio: 80dB
• Input Offset Voltage: 750uV
• Input Bias Current: 75pA
• Single Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (typ): ±15V
• Voltage Gain In Db: 122.92dB
• Power Supply Rejection Ratio: 98.42dB
• Power Supply Requirement: Dual
• Shut Down Feature: No
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (min): ±4.5V
• Dual Supply Voltage (max): ±18V
• Technology: BiFET
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Mounting: Through Hole
• Pin Count: 8
• Package Type: CDIP
• Lead Free Status / Rohs Status: Not Compliant

OP249
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 60 sec)
1
2
Absolute maximum ratings apply to packaged parts, unless otherwise noted.
For supply voltages less than ±18 V, the absolute maximum input voltage is
equal to the supply voltage.
OP249A (Q)
OP249F (Q)
OP249G (N, R)
OP249A (Q), OP249F (Q)
OP249G (N, R)
1
2
2
±18 V
Indefinite
−40°C to +85°C
−65°C to +150°C
Rating
±18 V
36 V
−65°C to +175°C
−55°C to +125°C
−40°C to +85°C
−65°C to +175°C
300°C
Rev. G | Page 6 of 20
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 6. Thermal Resistance
Package Type
8-Lead CERDIP (Q)
8-Lead PDIP (N)
8-Lead SOIC (R)
1
ESD CAUTION
θ
device in socket for CERDIP and PDIP packages; θ
soldered to printed circuit board for SOIC package.
JA
is specified for worst-case mounting conditions, that is, θ
96
θ
134
150
JA
1
JA
is specified for device
θ
12
37
41
JC
JA
is specified for
Unit
°C/W
°C/W
°C/W