LTC2991IMS#PBF Linear Technology, LTC2991IMS#PBF Datasheet - Page 31

• Manufacturer Part Number: LTC2991IMS#PBF
• Manufacturer: Linear Technology

Specifications of LTC2991IMS#PBF

• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Pin Count: 16
• Mounting: Surface Mount
• Package Type: MSOP
• Case Height: 0.86mm
• Screening Level: Industrial
• Lead Free Status / Rohs Status: Compliant

PACKAGE DESCRIPTION
Please refer to
http://www.linear.com/designtools/packaging/
(.0120 .0015)
GAUGE PLANE
0.305 0.038
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
(.007)
0.18
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
TYP
(.206)
5.23
MIN
RECOMMENDED SOLDER PAD LAYOUT
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
(.010)
0.254
DETAIL “A”
DETAIL “A”
(Reference LTC DWG # 05-08-1669 Rev Ø)
0 – 6 TYP
16-Lead Plastic MSOP
(.0197)
(.021 .006)
0.53 0.152
0.50
BSC
0.889 0.127
(.035 .005)
(.126 – .136)
3.20 – 3.45
SEATING
PLANE
MS Package
for the most recent package drawings.
(.007 – .011)
0.17 – 0.27
4.90 0.152
(.193 .006)
TYP
(.043)
MAX
1.10
(.0197)
0.50
BSC
16151413121110
1 2 3 4 5 6 7 8
4.039 0.102
(.159 .004)
(NOTE 3)
9
(.118 .004)
3.00 0.102
(NOTE 4)
0.280 0.076
(.011 .003)
MSOP (MS16) 1107 REV Ø
(.034)
0.86
REF
0.1016 0.0508
(.004 .002)
REF
LTC2991
31
2991f