2-2013298-3 TE Connectivity, 2-2013298-3 Datasheet - Page 5
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2-2013298-3
Manufacturer Part Number
2-2013298-3
Description
Manufacturer
TE Connectivity
Datasheet
1.2-2013298-1.pdf
(6 pages)
Specifications of 2-2013298-3
Socket Style
SO DIMM
Dram Type
Double Data Rate (DDR) III
Pcb Mount Style
Surface Mount
Module Orientation
Right Angle
Keying
Reverse
Dram Voltage
1.5 V
Socket Type
Memory Card
Number Of Positions
204
Row-to-row Spacing (mm [in])
8.20 [0.322]
Centerline (mm [in])
0.60 [0.024]
Number Of Rows
Dual
Ejector Type
Locking
Ejector Location
Both Ends
Number Of Keys
1
Latch Material
Stainless Steel
Latch Plating
Tin
Boss
With
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Copper Alloy
Housing Material
High Temperature Thermoplastic
Housing Color
Black
Stack Height (mm [in])
8.00 [0.315]
Insertion Style
Cam-In
Center Key (mm [in])
Offset Right
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Application Type
DDR 3 SO-DIMM
Packaging Method
Emboss on Reel
Lead Free Status / Rohs Status
Supplier Unconfirmed