ISD5008ED Nuvoton Technology Corporation of America, ISD5008ED Datasheet - Page 42
![IC VOICE REC/PL 4-8MIN EX 28TSOP](/photos/6/98/69885/256-28-tsop_sml.jpg)
ISD5008ED
Manufacturer Part Number
ISD5008ED
Description
IC VOICE REC/PL 4-8MIN EX 28TSOP
Manufacturer
Nuvoton Technology Corporation of America
Series
ISD5008r
Datasheet
1.ISD5008E.pdf
(47 pages)
Specifications of ISD5008ED
Interface
SPI/Microwire
Filter Pass Band
1.7 ~ 3.4kHz
Duration
4 ~ 8 Min
Mounting Type
Surface Mount
Package / Case
28-TSOP
For Use With
ISD-ES511 - EVALUATION SYSTEM FOR ISD5100ISD-ES501 - EVALUATION SYSTEM FOR ISD5008
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
1.
2.
3.
ISD
The backside of die is internally connected to V
may occur.
Double bond recommended.
This figure reflects the current die thickness. Please contact ISD as this thickness may change in the future.
ISD5008 Series
I.
II.
III.
Die Dimensions
X: 166.5 ±1 mils
Y: 302.4 ±1 mils
Die Thickness
11.5 ±1.0 mils
Pad Opening (min)
90 x 90 microns
3.5 x 3.5 mils
Figure 24: ISD5008 Series Bonding Physical Layout
(3)
V
SSA
MIC+
MIC–
V
SSD
ANAOUT+
V
SSD
SS
MISO
. It MUST NOT be connected to any other potential or damage
ANAOUT– ACAP
MOSI
SS SCLK V
SP–
ISD5008
CCD
V
(1)
SSA
(Unpackaged Die)
(2)
V
CCD
SP+
XCLK
V
CCA
INT
(2)
ANA IN
RAC
ISD5008 Product
V
AUX IN
SSA
AUXOUT
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