LM4819MX National Semiconductor, LM4819MX Datasheet - Page 18
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LM4819MX
Manufacturer Part Number
LM4819MX
Description
IC AMP AUDIO PWR .35W MONO 8SOIC
Manufacturer
National Semiconductor
Series
Boomer®r
Type
Class ABr
Specifications of LM4819MX
Output Type
1-Channel (Mono)
Max Output Power X Channels @ Load
350mW x 1 @ 16 Ohm
Voltage - Supply
2 V ~ 5.5 V
Features
Depop, Differential Inputs, Shutdown
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
LM4819MXTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LM4819MX
Manufacturer:
NS/国半
Quantity:
20 000
Company:
Part Number:
LM4819MX/NOPB
Manufacturer:
TI
Quantity:
6 700
Application Information
PCB LAYOUT GUIDELINES
This section provides practical guidelines for mixed signal
PCB layout that involves various digital/analog power and
ground traces. Designers should note that these are only
"rule-of-thumb" recommendations and the actual results will
depend heavily on the final layout.
General Mixed Signal Layout Recommendation
Power and Ground Circuits
For two layer mixed signal design, it is important to isolate
the digital power and ground trace paths from the analog
power and ground trace paths. Star trace routing techniques
(bringing individual traces back to a central point rather than
daisy chaining traces together in a serial manner) can have
a major impact on low level signal performance. Star trace
routing refers to using individual traces to feed power and
ground to each circuit or even device. This technique will
take require a greater amount of design time but will not
increase the final price of the board. The only extra parts
required will be some jumpers.
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17
Single-Point Power / Ground Connections
The analog power traces should be connected to the digital
traces through a single point (link). A "Pi-filter" can be helpful
in minimizing high frequency noise coupling between the
analog and digital sections. It is further recommended to put
digital and analog power traces over the corresponding digi-
tal and analog ground traces to minimize noise coupling.
Placement of Digital and Analog Components
All digital components and high-speed digital signals traces
should be located as far away as possible from analog
components and circuit traces.
Avoiding Typical Design / Layout Problems
Avoid ground loops or running digital and analog traces
parallel to each other (side-by-side) on the same PCB layer.
When traces must cross over each other do it at 90 degrees.
Running digital and analog traces at 90 degrees to each
other from the top to the bottom side as much as possible will
minimize capacitive noise coupling and cross talk.
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