LMV1012UPX-25/NOPB National Semiconductor, LMV1012UPX-25/NOPB Datasheet - Page 13

• Manufacturer Part Number: LMV1012UPX-25/NOPB
• Description: IC PREAMP AUDIO MONO MIC 4USMD
• Manufacturer: National Semiconductor
• Type: Class ABr

Specifications of LMV1012UPX-25/NOPB

• Output Type: 1-Channel (Mono)
• Voltage - Supply: 2 V ~ 5 V
• Features: Microphone
• Mounting Type: Surface Mount
• Package / Case: 4-MicroSMD
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 1-Channel Mono
• Audio Amplifier Function: Microphone
• Total Harmonic Distortion: 0.21@2200Ohm%
• Single Supply Voltage (typ): 3V
• Dual Supply Voltage (typ): Not RequiredV
• Supply Current (max): 0.25@5VmA
• Power Supply Requirement: Single
• Rail/rail I/o Type: No
• Single Supply Voltage (min): 2V
• Single Supply Voltage (max): 5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 4
• Package Type: Micro SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Max Output Power X Channels @ Load: -
• Lead Free Status / Rohs Status: Compliant
• Other names: LMV1012UPX-25

Physical Dimensions
NOTE: UNLESS OTHERWISE SPECIFIED.
1. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB
PAGE (www.national.com).
2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION.
4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS
PACKAGE HEIGHT.
5. REFERENCE JEDEC REGISTRATION MO-211. VARIATION CA.
inches (millimeters) unless otherwise noted
X1 = 0.955 mm X2 = 1.031 mm X3 = 0.300 mm
4-Bump Extreme Thin micro SMD
NS Package Number XPA04HLA
13
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