LM4938MHX/NOPB National Semiconductor, LM4938MHX/NOPB Datasheet - Page 16

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LM4938MHX/NOPB

Manufacturer Part Number
LM4938MHX/NOPB
Description
IC AMP AUDIO PWR 2.2W AB 28TSSOP
Manufacturer
National Semiconductor
Series
Boomer®r
Type
Class ABr
Datasheet

Specifications of LM4938MHX/NOPB

Output Type
2-Channel (Stereo) with Stereo Headphones
Max Output Power X Channels @ Load
2.2W x 2 @ 3 Ohm; 92mW x 2 @ 32 Ohm
Voltage - Supply
2.7 V ~ 5.5 V
Features
Bass Boost, Depop, Mute, Shutdown, Thermal Protection, Volume Control
Mounting Type
Surface Mount
Package / Case
28-TSSOP Exposed Pad, 28-eTSSOP, 28-HTSSOP
Operational Class
Class-AB
Audio Amplifier Output Configuration
2-Channel Stereo
Audio Amplifier Function
Headphone/Speaker
Total Harmonic Distortion
0.05@8Ohm@400mW%
Single Supply Voltage (typ)
3/5V
Dual Supply Voltage (typ)
Not RequiredV
Power Supply Requirement
Single
Rail/rail I/o Type
No
Power Supply Rejection Ratio
78dB
Single Supply Voltage (min)
2.7V
Single Supply Voltage (max)
5.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-20C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
28
Package Type
TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
LM4938MHX

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LM4938MHX/NOPB
Manufacturer:
TI/德州仪器
Quantity:
20 000
www.national.com
Application Information
The LM4938 has two operational amplifiers per channel. The
maximum internal power dissipation per channel operating in
the bridge mode is four times that of a single-ended ampli-
fier. From Equation (3), assuming a 5V power supply and a
4Ω load, the maximum single channel power dissipation is
1.27W or 2.54W for stereo operation.
The LM4938’s power dissipation is twice that given by Equa-
tion (2) or Equation (3) when operating in the single-ended
mode or bridge mode, respectively. Twice the maximum
power dissipation point given by Equation (3) must not ex-
ceed the power dissipation given by Equation (4):
The LM4938’s T
to a DAP pad that expands to a copper area of 2in
PCB, the LM4938MH’s θ
temperature T
nal power dissipation supported by the IC packaging. Rear-
ranging Equation (4) and substituting P
sults in Equation (5). This equation gives the maximum
ambient temperature that still allows maximum stereo power
dissipation without violating the LM4938’s maximum junction
temperature.
For a typical application with a 5V power supply and an 4Ω
load, the maximum ambient temperature that allows maxi-
mum stereo power dissipation without exceeding the maxi-
mum junction temperature is approximately 45˚C for the MH
package.
Equation (6) gives the maximum junction temperature
T
reduce the maximum junction temperature by reducing the
power supply voltage or increasing the load resistance. Fur-
ther allowance should be made for increased ambient tem-
peratures.
The above examples assume that a device is a surface
mount part operating around the maximum power dissipation
point. Since internal power dissipation is a function of output
power, higher ambient temperatures are allowed as output
power or duty cycle decreases.
If the result of Equation (2) is greater than that of Equation
(3), then decrease the supply voltage, increase the load
impedance, or reduce the ambient temperature. If these
measures are insufficient, a heat sink can be added to
reduce θ
copper area around the package, with connections to the
ground pin(s), supply pin and amplifier output pins. External,
solder attached SMT heatsinks such as the Thermalloy
7106D can also improve power dissipation. When adding a
heat sink, the θ
junction-to-case thermal impedance, θ
thermal impedance, and θ
JMAX
. If the result violates the LM4938’s 150˚C T
P
JA
DMAX
. The heat sink can be created using additional
A
JA
, use Equation (4) to find the maximum inter-
= 4 * (V
JMAX
T
P
T
A
is the sum of θ
DMAX
JMAX
= T
= 150˚C. In the MH package soldered
JMAX
' = (T
DD
= P
JA
)
SA
2
is 41˚C/W. At any given ambient
/(2π
DMAX
JMAX
– 2*P
is the sink-to-ambient thermal
2
JC
R
θ
− T
DMAX
L
, θ
JA
) Bridge Mode
CS
A
+ T
CS
)/θ
, and θ
DMAX
θ
JA
A
JA
is the case-to-sink
(Continued)
for P
SA
. (θ
DMAX
JC
2
is the
JMAX
on a
' re-
(3)
(4)
(5)
(6)
,
16
impedance.) Refer to the Typical Performance Character-
istics curves for power dissipation information at lower out-
put power levels.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is
critical for low noise performance and high power supply
rejection. Applications that employ a 5V regulator typically
use a 10 µF in parallel with a 0.1 µF filter capacitor to
stabilize the regulator’s output, reduce noise on the supply
line, and improve the supply’s transient response. However,
their presence does not eliminate the need for a local 1.0µF
tantalum bypass capacitance connected between the
LM4938’s supply pins and ground. Do not substitute a ce-
ramic capacitor for the tantalum. Doing so may cause oscil-
lation. Keep the length of leads and traces that connect
capacitors between the LM4938’s power supply pin and
ground as short as possible. Connecting a 1µF capacitor,
C
internal bias voltage’s stability and the amplifier’s PSRR. The
PSRR improvements increase as the BYPASS pin capacitor
value increases. Too large a capacitor, however, increases
turn-on time and can compromise the amplifier’s click and
pop performance. The selection of bypass capacitor values,
especially C
click and pop performance (as explained in the following
section, Selecting Proper External Components), system
cost, and size constraints.
SELECTING PROPER EXTERNAL COMPONENTS
Optimizing the LM4938’s performance requires properly se-
lecting external components. Though the LM4938 operates
well when using external components with wide tolerances,
best performance is achieved by optimizing component val-
ues.
The LM4938 is unity-gain stable, giving a designer maximum
design flexibility. The gain should be set to no more than a
given application requires. This allows the amplifier to
achieve minimum THD+N and maximum signal-to-noise ra-
tio. These parameters are compromised as the closed-loop
gain increases. However, low gain circuits demand input
signals with greater voltage swings to achieve maximum
output power. Fortunately, many signal sources such as
audio CODECs have outputs of 1V
refer to the Audio Power Amplifier Design section for more
information on selecting the proper gain.
INPUT CAPACITOR VALUE SELECTION
Amplifying the lowest audio frequencies requires a high
value input coupling capacitor (0.33µF in Figure 2), but high
value capacitors can be expensive and may compromise
space efficiency in portable designs. In many cases, how-
ever, the speakers used in portable systems, whether inter-
nal or external, have little ability to reproduce signals below
150 Hz. Applications using speakers with this limited fre-
quency response reap little improvement by using a large
input capacitor.
Besides effecting system cost and size, the input coupling
capacitor has an affect on the LM4938’s click and pop per-
formance. When the supply voltage is first applied, a tran-
sient (pop) is created as the charge on the input capacitor
changes from zero to a quiescent state. The magnitude of
the pop is directly proportional to the input capacitor’s size.
Higher value capacitors need more time to reach a quiescent
DC voltage (usually V
rent. The amplifier’s output charges the input capacitor
B
, between the BYPASS pin and ground improves the
B
, depends on desired PSRR requirements,
DD
/2) when charged with a fixed cur-
RMS
(2.83V
P-P
). Please

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