PACDN1416CG California Micro Devices Corporation, PACDN1416CG Datasheet

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PACDN1416CG

Manufacturer Part Number
PACDN1416CG
Description
Manufacturer
California Micro Devices Corporation
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PACDN1416CG
Manufacturer:
CMD
Quantity:
69 000
10/10/03
Features
Applications
© 2003 California Micro Devices Corp. All rights reserved.
Electrical Schematic
4, 8, or 16 transient voltage suppressors in a single
package
In-system Electrostatic Discharge (ESD) protection
to +25kV contact discharge per IEC 61000-4-2
international standard
Compact Chip Scale Package (0.65mm pitch) for-
mat saves board space and eases layout in space
critical applications compared to discrete solutions
and traditional wire bonded packages
Lead-free versions available
ESD protection for sensitive electronic equipment
I/O port, keypad and button circuitry protection for
portable devices
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Cameras and Camcorders
Notebooks
Desktop PCs
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
B1
A1
PACDN1404C
ESD Protection Arrays, Chip Scale Package
B2
A2
B3
A3
B1
A1
B2
A2
PACDN1408C
B3
A3
B4
A4
Product Description
The PACDN1404C, PACDN1408C and PACDN1416C
are transient voltage suppressor arrays that provide a
very high level of protection for sensitive electronic
components that may be subjected to ESD.
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard (Level 4, +8kV contact dis-
charge). All I/Os are rated at +25kV using the IEC
61000-4-2 contact discharge method. Using the MIL-
STD-883D (Method 3015) specification for Human
Body Model (HBM) ESD, all pins are protected for con-
tact discharges to greater than +30kV.
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards with-
out
PACDN1408C and PACDN1416C are available with
optional lead-free finishing.
B5
A5
the
L Fax: 408.263.7846
D1
C1
B1
A1
use
D2
C2
B2
A2
PACDN1416C
PACDN1404C/1408C/1416C
of
D3
C3
B3
A3
underfill.
D4
C4
B4
A4
L
D5
C5
B5
A5
www.calmicro.com
The
PACDN1404C,
1

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PACDN1416CG Summary of contents

Page 1

ESD Protection Arrays, Chip Scale Package Features • transient voltage suppressors in a single package • In-system Electrostatic Discharge (ESD) protection to +25kV contact discharge per IEC 61000-4-2 international standard • Compact Chip Scale Package (0.65mm ...

Page 2

... DN1408 PACDN1416C DN1416 + " character for the top side orientation mark. PACDN1404C/1408C/1416C BOTTOM VIEW (Bumps Up View BOTTOM VIEW (Bumps Up View BOTTOM VIEW (Bumps Up View Lead-free Finish Ordering Part 1 Number PACDN1404CG PACDN1408CG PACDN1416CG L Fax: 408.263.7846 L www.calmicro.com 2 Part Marking D14 DN1408 DN1416 10/10/03 ...

Page 3

Specifications PARAMETER Storage Temperature Range PARAMETER Operating Temperature Range SYMBOL PARAMETER V Reverse Standoff Voltage REV I Leakage Current LEAK V Signal Clamp Voltage SIG Positive Clamp Negative Clamp V In-system ESD Withstand Voltage ESD a) Human Body Model, MIL-STD-883, ...

Page 4

Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening ...

Page 5

Mechanical Details The PACDN1404C/1408C/1416C devices are pack- aged in custom Chip Scale Packages (CSP). PACDN1404C 6-bump CSP Mechanical Specifications The PACDN1404C devices are packaged in a 6-bump custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSIONS Package Custom ...

Page 6

Mechanical Details (cont’d) PACDN1408C 10-bump CSP Mechanical Specifications The PACDN1408C devices are packaged in a 10-bump custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps Millimeters Dim Min Nom Max A1 1.109 1.154 1.199 ...

Page 7

Mechanical Details (cont’d) PACDN1416C 20-bump CSP Mechanical Specifications The PACDN1416C devices are packaged in a 20-bump custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps Millimeters Dim Min Nom Max A1 2.409 2.454 2.499 ...

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