MAX4411ETP+T Maxim Integrated Products, MAX4411ETP+T Datasheet - Page 13
![IC AMP AUDIO .08W STER AB 20TQFN](/photos/6/50/65030/20-tqfn_pkg_sml.jpg)
MAX4411ETP+T
Manufacturer Part Number
MAX4411ETP+T
Description
IC AMP AUDIO .08W STER AB 20TQFN
Manufacturer
Maxim Integrated Products
Series
DirectDrive™r
Type
Class ABr
Datasheet
1.MAX4411EBET.pdf
(18 pages)
Specifications of MAX4411ETP+T
Output Type
Headphones, 2-Channel (Stereo)
Max Output Power X Channels @ Load
80mW x 2 @ 16 Ohm
Voltage - Supply
1.8 V ~ 3.6 V
Features
Depop, Short-Circuit and Thermal Protection, Shutdown
Mounting Type
Surface Mount
Package / Case
20-TQFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Table 1. Suggested Capacitor Manufacturers
Note: Please indicate you are using the MAX4411 when contacting these component suppliers.
Figure 6. MAX4411 and MAX5408 Volume Control Circuit
output ripple. Likewise, decreasing the ESR of C2
reduces both ripple and output resistance. Lower
capacitance values can be used in systems with low
maximum output power levels. See the Output Power
vs. Charge-Pump Capacitance and Load Resistance
graph in the Typical Operating Characteristics.
The power-supply bypass capacitor (C3) lowers the out-
put impedance of the power supply, and reduces the
impact of the MAX4411’s charge-pump switching tran-
sients. Bypass PV
place it physically close to the PV
The addition of a digital potentiometer provides simple
volume control. Figure 6 shows the MAX4411 with the
MAX5408 dual log taper digital potentiometer used as
an input attenuator. Connect the high terminal of the
MAX5408 to the audio input, the low terminal to
ground, and the wiper to C
top position passes the audio signal unattenuated.
Setting the wiper to the lowest position fully attenuates
the input.
Proper layout and grounding are essential for optimum
performance. Connect PGND and SGND together at a
single point on the PC board. Connect all components
associated with the charge pump (C2 and C3) to the
PGND plane. Connect PV
Taiyo Yuden
TDK
SUPPLIER
DD
______________________________________________________________________________________
Power-Supply Bypass Capacitor
with C3, the same value as C1, and
80mW, Fixed-Gain, DirectDrive, Stereo
Adding Volume Control
DD
LEFT AUDIO
Headphone Amplifier with Shutdown
Layout and Grounding
RIGHT AUDIO
IN
INPUT
INPUT
and SV
. Setting the wiper to the
DD
12
6
11
5
and PGND pins.
H0
H1
L0
L1
DD
800-348-2496
847-803-6100
MAX5408
PHONE
together at the
W1A 10
W0A 7
C
C
IN
IN
13
15
device. Connect PV
device. Bypassing of both supplies is accomplished by
charge-pump capacitors C2 and C3 (see Typical
Application Circuit). Place capacitors C2 and C3 as
close to the device as possible. Route PGND and all
traces that carry switching transients away from SGND
and the traces and components in the audio signal
path.
The QFN package features an exposed paddle that
improves thermal efficiency of the package. However,
the MAX4411 does not require additional heatsinking.
Ensure that the exposed paddle is isolated from
GND or V
GND or V
When using the MAX4411 in a UCSP package, make
sure the traces to OUTR (bump C2) are wide enough to
handle the maximum expected current flow. Multiple
traces may be necessary.
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit
board techniques, bump-pad layout, and recommend-
ed reflow temperature profile, as well as the latest infor-
mation on reliability testing results, go to Maxim’s
website at www.maxim-ic.com/ucsp and look up the
Application Note: UCSP–A Wafer-Level Chip-Scale
Package.
INL
INR
MAX4411
UCSP Applications Information
847-925-0899
847-390-4405
OUTL
OUTR
DD
DD
FAX
11
9
.
. Do not connect the exposed paddle to
SS
and SV
www.t-yuden.com
www.component.tdk.com
SS
WEBSITE
together at the
13