CXA1726AM Sony, CXA1726AM Datasheet
CXA1726AM
Related parts for CXA1726AM
CXA1726AM Summary of contents
Page 1
... Multiplier IC for Displays Description The CXA1726AM/ multiplier IC which is used for dynamic convergence, dynamic focus and others in CRT display monitors and projectors used in conjunction with an IC (CXA1470AM/AS) which generates waveforms compensation. Features Analog multiplier • Maximum input voltage ±1.3V • Maximum output voltage ± ...
Page 2
... CXA1726AM/AS Description Positive supply voltage pin. Control pin of switch unit. The signal input from IN1 is selected for "a" side or "b" side by the SW1 applied voltage. When SW1 less, low turns to " ...
Page 3
... CXA1726AM/AS Description Multiplier IN Y input pins. Multiplier output pins. Operational amplifier input pins. Operational amplifier output pins. GND Negative supply voltage pin. ...
Page 4
... 1V SG2 100% Output Y, OUT 50% t Input 0% Measure "t". – 4 – CXA1726AM/AS Description Input pins of multiplier with switch. Switch pin to select "a" side or "b" side of multiplier with switch. "a" side 2.0V "b" side 2.6V Min. Typ. ...
Page 5
... IN = SG1 OUT SW SW OUT OUT SG2 100% Output IN, OUT 50% t Input 0% Measure "t". Measurement Conditions point A1 A16 – 5 – CXA1726AM/AS Min. Typ. Max. Unit –1 0.35 1 µ ±3.65 –3 –0.15 dB 1.4 –6 – Min. Typ. Max. ...
Page 6
... CXA1726AM/AS ...
Page 7
... GND GND A1470AM/ GND C10 R11 R13 1µ 2.2k 8.2k GND GND GND – 7 – CXA1726AM/AS C3 22µ GND GND GND C7 47µ VDIN HDIN GND GND GND GND ...
Page 8
... When SW1 less, low turns to "a" side 2.6V or more, high turns to "b" side. The unselected output pin is connected to GND. For the multipliers with a switch, "a" side or "b" side is selected under the same conditions. GND f = 1MHz GND f = 200kHz – 8 – CXA1726AM/AS 5Vp-p 3Vp-p ...
Page 9
... Multiplier gain characteristics 2 OUT [V] 1 –2 – –1 –2 Input 5Vp-p Sine wave X mul. Y 10M [Hz] Input 5Vp-p Sine wave 10k 10k IN 10M [Hz] Input – [V] – 9 – CXA1726AM/AS OUT OUT ...
Page 10
... Two kinds of package surface: 1.All mat surface type. 2.All mirror surface type. 0.5 ± 0.1 0.9 ± 0.15 PACKAGE STRUCTURE MOLDING COMPOUND EPOXY RESIN SOLDER/PALLADIUM LEAD TREATMENT SDIP-30P-01 LEAD MATERIAL COPPER ALLOY SDIP030-P-0400 PACKAGE MASS 1.8g – 10 – CXA1726AM/AS + 0.4 2.3 – 0.15 0.1 + 0.2 0.1 – 0.05 0° to 15° PLATING ...