VSC8201 Vitesse Semiconductor Corp., VSC8201 Datasheet
VSC8201
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VSC8201 Summary of contents
Page 1
... VSC8201 Gigabit Ethernet Transceiver. Power Supply Organization and Decoupling The VSC8201 requires a 3.3v and a 1.5v power supply source for operation using GMII, MII or TBI MAC interfaces. In RGMII and RTBI modes, an additional 2.5v supply is needed as specified by the RGMI/RTBI standard. The VSC8201 can be powered using the following options: • ...
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... VITESSE - CONFIDENTIAL & PROPRIETARY - DO NOT COPY WITHOUT PERMISSION Local Decoupling Required Four 0.1uF capacitors Two 0.1 uF capacitors One 0.1 uF capacitor Four 0.1uF capacitors Local Decoupling Required Four 0.1uF capacitors Two 0.1uF capacitors One 0.1 uF capacitor Four 0.1uF capacitors VSC8201 128 LQFP (Top View) VSC8201DL ...
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... Panasonic EXCELSA39 or similar. • Steward HI 1206N101R-00 or similar. Rev. 1.6.3 - 9/29/04 VITESSE - CONFIDENTIAL & PROPRIETARY - DO NOT COPY WITHOUT PERMISSION . Note:Place vias close to or under neath the capacitor pads for low inductive path and higher heat dissipation rate. Figure 3: Power Supply Decoupling Schematic VSC8201DL 0 Page ...
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... To isolate the board from the ESD events and to provide a common-mode noise ground path, a separate chassis ground region should be allocated. This should provide an electrical connection to the external chassis and the shield ground to discharge common-mode noise through a 75-ohm resistor and a single 1000pF 2kV capacitor. See “VSC8201 System Schematic” in the datasheet. Key points • ...
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... Regulator Circuit For systems with a single power supply, the VSC8201 provides an option to generate the 1.5v supply from the 3.3v supply by using the on chip regulator. The internal regulator is enabled by having a 10k pull-up on the REG_EN pin. To use the Regulator the following additional components are required: • ...
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... T squelch level control, the VSC8201 uses these bits to control the ActiPHY table: 2. Enabling the interrupt pin: The VSC8201 conveys the valid signal detect signal via the MDINT# pin. In order to enable the MDINT# pin the station manager must set the MII register 25:15 ...
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... Design for Signal Integrity Many high speed signal pins on the VSC8201 have rise/fall times of the order of 0.7 to 2.4 ns. Because of these fast rise/fall times, inter- connects should be treated as transmission lines rather than simple lumped element connections. Use of transmission lines with a basic understanding of line matching will reduce signal reflections which degrades overall performance of the part. ...
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... The common value for the characteristic impedance of a transmission line is 50 Rev. 1.6.3 - 9/29/04 VITESSE - CONFIDENTIAL & PROPRIETARY - DO NOT COPY WITHOUT PERMISSION 4 b ˜ – § · ps ---------- - – © ¹ inch t =141ps for a microstrip line. If the rise time of the signal is 0.7ns then a trace VSC8201DL - Page ...
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... High Speed signals of VSC8201 Rev. 1.6.3 - 9/29/04 VITESSE - CONFIDENTIAL & PROPRIETARY - DO NOT COPY WITHOUT PERMISSION Figure 7: VSC8201 System Schematic VSC8201DL - Page ...
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... For the MAC transmit interface, if the output resistance of the corresponding pins on the MAC side is less than 50 termination resistor should be placed close to the MAC device. For the VSC8201 MAC receive interface, each pin is self-calibrating to an output resistance of 50 resistors are not required as long as the characteristic impedance of the trace shown in the previous section, for a rise time of 0 ...
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... VSC8201’s RGMII Interface Description The VSC8201 PHY is designed, as per the RGMII version 1.2a specification, to support RGMII operation at a 2.5v I/O supply. In addition to the RGMII requirements specified by the standard, the PHY also has an internal clock delay feature (enabled by setting MII Register 23 ...
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... Needs extra board space for the additional trace delays on the RXC and TXC traces. Rev. 1.6.3 - 9/29/04 VITESSE - CONFIDENTIAL & PROPRIETARY - DO NOT COPY WITHOUT PERMISSION 1.5ns-2ns PCB trace additional PCB trace delay RXC RX_CTL RD3 RD2 RD1 RD0 TD3 TD2 TD1 TD0 TX_CTL TXC 1.5ns-2ns PCB trace additional PCB trace delay VSC8201DL VDDIO=3.0 - 3.6v VSC8201 - Page ...
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... Needs extra board space for the additional trace delays needed on the TD[3:0] and the TX_CTL traces. Rev. 1.6.3 - 9/29/04 VITESSE - CONFIDENTIAL & PROPRIETARY - DO NOT COPY WITHOUT PERMISSION RXC RX_CTL RD3 RD2 RD1 RD0 TD3 TD2 TD1 TD0 TX_CTL TXC VSC8201DL VDDIO=3.0 - 3.6v VSC8201 - Page ...
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... The MAC which is at 3.3V should be capable of detecting 2.5V logic levels. Rev. 1.6.3 - 9/29/04 VITESSE - CONFIDENTIAL & PROPRIETARY - DO NOT COPY WITHOUT PERMISSION 1N914 470 ohms MA2J111 MA111 or equivalent RXC RX_CTL RD3 RD2 RD1 RD0 TD3 TD2 TD1 TD0 TX_CTL TXC VSC8201DL VDDIO_PHY 0.1uf 0.001uf VDDIO_PHY VSC8201 - Page ...
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... LED/ADDRESS Circuit The following pins of the VSC8201 are input/output pins: • ADDR(4)/ACTIVITY • ADDR(3)/DUPLEX • ADDR(2)/LINK1000 • ADDR(1)/LINK100 • ADDR(0)/LINK10 • REG_EN/QUALITY In input mode these pins are sampled on the rising edge of RST# signal. After reset these are in output mode.The ADDR and REG_EN pins sampled at startup determine the polarity of the LED output signal ...
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... This occurs when the current sinking capability of the pins in a logic ‘0’ state is exceeded. For the VSC8201, the MDIO input capacitance is 5pF, and the maximum current sinking capacity is 10mA ...
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... System designers can choose either the tab-up or tab-down connectors. LEDs can also be integrated into the connectors. Due to the orientation, the pinouts of the tab-up and the tab-down are reversed. The VSC8201 will work equally well using either orienta- tion. The tab-down connector is more wide-spread than the tab-up connector in the NIC card industry. ...
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... This module has an integrated magnetic module Magnetic Modules For best performance, proper magnetic modules must be used with the VSC8201. In addition, some companies integrate the magnetic modules into the RJ-45 connector. Note on Return-Loss Compensation Circuit: Testing has indicated that some magnetic modules may not pass the IEEE specification for return loss. In these cases, an extra resistor-capacitor circuit can be added for each of the sub-channels. See “ ...
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... The amount of heat dissipated by path 2. depends on various factors like pad size, wired length, layer configuration, thickness, materials etc. of the PC board but, typically, 10% to 50% of the heat is dissipated through the PC board. Although low power consumption of the VSC8201 eliminates the need of external heatsinks or fans in most designs always recom- mended to follow certain guidelines for adequate heat dissipation. ...
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... Figure 14: ”Thermal Ground Plane Connections”, below). Rev. 1.6.3 - 9/29/04 VITESSE - CONFIDENTIAL & PROPRIETARY - DO NOT COPY WITHOUT PERMISSION PCB Thermal Via BGA Ball Pad Figure 13: Thermal Via Layout VSC8201 BGA Package Figure 14: Thermal Ground Plane Connections PCB Traces BGA Balls 1-ounce Ground Plane Thermal via ...
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... VITESSE - CONFIDENTIAL & PROPRIETARY - DO NOT COPY WITHOUT PERMISSION Date Description 16 Jan 03 7 Aug 03 Updated decoupling power supply, capacitor lay- out (added LBGA figure), and schematic 29 Sep 04 Changed CIS8201 to VSC8201 globally. Integrated the information from the CIS8201 RGMII 3.3V Appnote into this document. All Rights Reserved. VSC8201DL - Page ...