24LC16B Microchip Technology Inc., 24LC16B Datasheet

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24LC16B

Manufacturer Part Number
24LC16B
Description
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of 24LC16B

Dc
0534

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*24XX16 is used in this document as a generic part
number for the 24AA16/24LC16B devices.
Device Selection Table
Features:
• Single supply with operation down to 1.7V
• Low-power CMOS technology:
• 2-wire serial interface, I
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (2.5V) and 400 kHz clock compatibility
• Page write time 5 ms max.
• Self-timed erase/write cycle
• 16-byte page write buffer
• Hardware write-protect
• ESD protection > 4,000V
• More than 1 million erase/write cycles
• Data retention > 200 years
• Factory programming available
• Packages include 8-lead PDIP, SOIC, TSSOP,
• Pb-free and RoHS compliant
• Temperature ranges:
© 2007 Microchip Technology Inc.
Note 1:
24LC16B
Number
- Active current 1 mA, typical
- Standby current, 1 μa, typical
MSOP, DFN and SOT-23-5
- Industrial (I):
- Automotive (E): -40°C to +125°C
24AA16
24AA16 devices, 2.5V for 24LC16B devices
Part
100 kHz for V
Range
1.7-5.5
2.5-5.5
Vcc
-40°C to +85°C
CC
2
C™ compatible
Max. Clock
<2.5V
Frequency
400 kHz
400 kHz
16K I
(1)
24AA16/24LC16B
2
Ranges
Temp.
C
I, E
I
Serial EEPROM
Description:
The Microchip Technology Inc. 24AA16/24LC16B
(24XX16*) is a 16 Kbit Electrically Erasable PROM.
The device is organized as eight blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V with standby
and active currents of only 1 μA and 1 mA,
respectively. The 24XX16 also has a page write
capability for up to 16 bytes of data. The 24XX16 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, 2x3 DFN and MSOP packages, and is
also available in the 5-lead SOT-23 package.
Package Types
Block Diagram
V
SDA
SDA
A0
A1
A2
SCL
SS
I/O
Vss
Note:
Control
Logic
V
V
I/O
CC
SS
1
2
3
4
SCL
2
3
PDIP, MSOP
1
SOT-23-5
Pins A0, A1 and A2 are not used by the 24XX16 (no
internal connections).
WP
5
4
Memory
Control
8
7
6
5
Logic
WP
Vcc
V
WP
SCL
SDA
CC
V
A0
A1
A2
SS
V
XDEC
A0
A2
A1
SS
1
2
3
4
SOIC, TSSOP
1
2
3
4
DS21703G-page 1
DFN
Sense Amp.
R/W Control
Generator
EEPROM
Latches
Array
YDEC
Page
HV
8
7
6
5
8
7
6
5
V
SCL
SDA
WP
CC
V
WP
SCL
SDA
CC

Related parts for 24LC16B

24LC16B Summary of contents

Page 1

... Note 1: 100 kHz for V <2.5V CC Features: • Single supply with operation down to 1.7V 24AA16 devices, 2.5V for 24LC16B devices • Low-power CMOS technology: - Active current 1 mA, typical - Standby current, 1 μa, typical 2 • 2-wire serial interface, I C™ compatible • Schmitt Trigger inputs for noise suppression • ...

Page 2

... ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................6.5V CC All inputs and outputs w.r.t. V ......................................................................................................... -0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins ......................................................................................................................................................≥ † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device ...

Page 3

... This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com. © 2007 Microchip Technology Inc. 24AA16/24LC16B Industrial (I -40°C to +85° Automotive (E -40° ...

Page 4

... FIGURE 1-1: BUS TIMING DATA 5 3 SCL 7 6 SDA 14 IN SDA OUT FIGURE 1-2: BUS TIMING START/STOP SCL 6 7 SDA Start DS21703G-page Stop © 2007 Microchip Technology Inc. ...

Page 5

... SCL SDA Start Condition © 2007 Microchip Technology Inc. 24AA16/24LC16B 3.4 Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal ...

Page 6

... Device Addressing A control byte is the first byte received following the Start condition from the master device (Figure 3-2). The control byte consists of a four-bit control code. For the 24XX16, this is set as ‘ 1010 ’ binary for read and write operations. The next three bits of the control byte are the block-select bits (B2, B1, B0) ...

Page 7

... B0 Bus Activity Block Select Bits © 2007 Microchip Technology Inc. 24AA16/24LC16B 4.2 Page Write The write control byte, word address and the first data byte are transmitted to the 24XX16 in the same way byte write. However, instead of generating a Stop condition, the master transmits data bytes to ...

Page 8

... ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally-timed write cycle and ACK polling can then be initiated immediately ...

Page 9

... R T SDA Line S Bus Activity © 2007 Microchip Technology Inc. 24AA16/24LC16B 7.3 Sequential Read Sequential reads are initiated in the same way as a random read, except that once the 24XX16 transmits the first data byte, the master issues an acknowledge as opposed to a Stop condition in a random read. This directs the 24XX16 to transmit the next sequentially- addressed 8-bit word (Figure 7-3) ...

Page 10

... FIGURE 7-2: RANDOM READ S T Bus Activity Control A Master Byte B2B1B0 SDA Line Block Select Bus Activity FIGURE 7-3: SEQUENTIAL READ Bus Activity Control Master Byte Data (n) SDA Line Bus Activity K DS21703G-page Word Control A Address (n) Byte ...

Page 11

... SCL low. Changes during SCL high are reserved for indicating Start and Stop conditions. 8.2 Serial Clock (SCL) The SCL input is used to synchronize the data transfer to and from the device. © 2007 Microchip Technology Inc. 24AA16/24LC16B TSSOP DFN MSOP SOT- ...

Page 12

... NNN 8-Lead MSOP XXXXXT YWWNNN 8-Lead 2x3 DFN XXX YWW NN 5-Lead SOT-23 XXNN DS21703G-page 12 Example: 24LC16B e I/P 3 13F 0527 Example: 24LC16BI 0527 13F Example: 4L16 I527 13F Example: 4L16I 52713F Example: 254 527 13 Example: B53F © 2007 Microchip Technology Inc. ...

Page 13

... Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion. *Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. © 2007 Microchip Technology Inc. 24AA16/24LC16B 1st Line Marking Codes SOT-23 MSOP I Temp. ...

Page 14

... Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane ...

Page 15

... Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc. 24AA16/24LC16B ...

Page 16

... Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width ...

Page 17

... Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc. 24AA16/24LC16B EXPOSED PAD ...

Page 18

... Plastic Micro Small Outline Package (MS or UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width ...

Page 19

... Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. © 2007 Microchip Technology Inc. 24AA16/24LC16B ...

Page 20

... APPENDIX A: REVISION HISTORY Revision D Corrections to Section 1.0, Electrical Characteristics. Revision E Added DFN package. Revision F Revised Figure 3-2 Control Byte Allocation; Figure 4-1 Byte Write; Figure 4-2 Page Write; Section 6.0 Write Protection; Figure 7-1 Current Address Read; Figure 7- 2 Random Read; Figure 7-3 Sequential Read; Section 8.3 Write-Protect (WP). ...

Page 21

... To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2007 Microchip Technology Inc. 24AA16/24LC16B CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • ...

Page 22

... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: 24AA16/24LC16B Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...

Page 23

... To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office PART NO. X /XX Device Temperature Package Range 24AA16: = 1.7V, 16 Kbit I 24AA16T: = 1.7V, 16 Kbit I (Tape and Reel) 24LC16B: = 2.5V, 16 Kbit I 24LC16BT: = 2.5V, 16 Kbit I (Tape and Reel) Temperature I = -40°C to +85°C Range -40°C to +125°C Package 2x3 DFN, 8-lead P ...

Page 24

... NOTES: DS21703G-page 24 © 2007 Microchip Technology Inc. ...

Page 25

... Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. © 2007 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, K ...

Page 26

... Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2007 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris ...

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