LM4863N National Semiconductor, LM4863N Datasheet
LM4863N
Specifications of LM4863N
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LM4863N Summary of contents
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... Typical Application Note: Pin out shown for SO package. Refer to the Connection Diagrams for the pinout of the TSSOP, Exposed-DAP TSSOP, and Exposed-DAP LLP packages. Boomer ® registered trademark of National Semiconductor Corporation. © 2006 National Semiconductor Corporation Key Specifications THD+N O LM4863LQ, 3Ω ...
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Connection Diagrams Top View Order Number LM4863M See NS Package Number M16B for SO Top View Order Number LM4863MTE See NS Package Number MXA20A for Exposed-DAP TSSOP * Not recommended for new designs. Contact NSC Audio Marketing. www.national.com 01288128 See ...
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... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage Storage Temperature Input Voltage Power Dissipation (Note 4) ESD Susceptibility(Note 5) ESD Susceptibility (Note 6) Junction Temperature Solder Information Small Outline Package Vapor Phase (60 sec ...
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Electrical Characteristics for Bridged-Mode Operation The following specifications apply for V Symbol Parameter THD+N Total Harmonic Distortion+Noise PSRR Power Supply Rejection Ratio X Channel Separation TALK SNR Signal To Noise Ratio Electrical Characteristics for Single-Ended Operation The following specifications apply ...
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Typical Performance Characteristics MTE Specific Characteristics LM4863MTE THD+N vs Output Power LM4863MTE THD+N vs Output Power LM4863MTE Power Dissipation vs Power Output 01288197 01288196 01288190 5 LM4863MTE THD+N vs Frequency 01288199 LM4863MTE THD+N vs Frequency 01288198 LM4863MTE Power Derating Curve ...
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Typical Performance Characteristics MTE Specific Characteristics LM4863MTE (Note 17) Power Derating Curve Note 17: This curve shows the LM4863MTE’s thermal dissipation ability at different ambient temperatures given these conditions: 500LFPM + JEDEC board: The part is soldered to a 1S2P ...
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Non-MTE Specific Characteristics THD+N vs Output Power THD+N vs Output Power THD+N vs Output Power (Continued) 01288107 01288187 01288186 7 THD+N vs Output Power 01288108 THD+N vs Frequency 01288189 THD+N vs Frequency 01288188 www.national.com ...
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Non-MTE Specific Characteristics Output Power vs Load Resistance Output Power vs Supply Voltage Output Power vs Supply Voltage www.national.com (Continued) 01288184 01288109 01288111 8 Power Dissipation vs Supply Voltage 01288185 Output Power vs Supply Voltage 01288110 Output Power vs Load ...
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Non-MTE Specific Characteristics Output Power vs Load Resistance Dropout Voltage vs Supply Voltage Power Dissipation vs Output Power (Continued) 01288113 01288115 01288117 9 Power Dissipation vs Output Power 01288114 Power Derating Curve 01288116 Noise Floor 01288118 www.national.com ...
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Non-MTE Specific Characteristics Channel Separation Power Supply Rejection Ratio Supply Current vs Supply Voltage www.national.com (Continued) 01288119 Frequency Response 01288121 01288123 10 Channel Separation 01288120 Open Loop 01288122 ...
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... Demonstration Board Layout section. Further de- tailed and specific information concerning PCB layout, fabri- cation, and mounting an LLP package is available from National Semiconductor’s package Engineering Group. When contacting them, ask for "Preliminary Application Note for the Assembly of the LLP Package on a Printed Circuit Board, Revision A dated 7/14/00." ...
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Application Information * Refer to the section Proper Selection of External Components, for a detailed discussion of C FIGURE 1. Typical Audio Amplifier Application Circuit Pin out shown for the SO package. Refer to the Connection Diagrams for the pinout ...
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Application Information mode or bridge mode, respectively. Twice the maximum power dissipation point given by Equation (3) must not ex- ceed the power dissipation given by Equation (4 θ P ’ − T DMAX JMAX A ...
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Application Information phone jack contact pin from -OUTA and allows R1 to pull the HP Sense pin This enables the headphone func- DD tion, turns off Amp2A and Amp2B, and mutes the bridged speaker. The amplifier ...
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Application Information sents a tradeoff: as the size of C increases, the turn-on time B increases. There is a linear relationship between the size of C and the turn-on time. Here are some typical turn-on times B for various values ...
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Application Information FIGURE 3. MTE PC board layout: all layers superimposed FIGURE 4. MTE PC board layout: Component-side Silkscreen FIGURE 5. Recommended MTE PC board layout: Component-side layout www.national.com (Continued) 01288194 FIGURE 6. Recommended MTE PC board layout: 01288193 FIGURE ...
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Application Information FIGURE 8. Recommended LQ PC board layout: Component-side layout FIGURE 9. Recommended LQ PC board layout: upper inner-layer layout (Continued) 01288132 FIGURE 10. Recommended LQ PC board layout: 01288133 FIGURE 11. Recommended LQ PC board layout: 17 01288134 ...
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Revision History Rev 1.1 10/30/06 www.national.com Date Removed all references to the 16–lead plastic-DIP package. 18 Description ...
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Physical Dimensions inches (millimeters) unless otherwise noted 16-Lead (0.300" Wide) Molded Small Outline Package, JEDEC 20-Lead Molded PKG, TSSOP, JEDEC, 4.4mm BODY WIDTH Order Number LM4863M NS Package Number M16B Order Number LM4863MT NS Package Number MTC20 19 www.national.com ...
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Physical Dimensions 20-Lead Molded TSSOP, Exposed Pad, 6.5x4.4x0.9mm www.national.com inches (millimeters) unless otherwise noted (Continued) Order Number LM4863MTE NS Package Number MXA20A 24-Lead Molded pkg, Leadframe Package LLP Order Number LM4863LQ NS Package Number LQA24A 20 ...
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