TDA8007B Philips Semiconductors, TDA8007B Datasheet
TDA8007B
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TDA8007B Summary of contents
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... DATA SHEET TDA8007B Multiprotocol smart card interface Objective specification File under Integrated Circuits, IC02 INTEGRATED CIRCUITS 1999 Nov 11 ...
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... Digital pay TV, Access control etc.). GENERAL DESCRIPTION The TDA8007B is a low cost card interface for dual smart card readers. Controlled through a parallel bus, it takes care of all ISO 7816, EMV and GSM11-11 requirements. It may be interfaced to the P0/P2 ports of an 80C51 family microcontroller, and be addressed as a memory through MOVX instructions ...
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... XTAL1 PACKAGE DESCRIPTION plastic low profile quad flat package; 48 leads; body 1.4mm 3 Objective specification MIN. TYP. 2 4.75 5.0 4.6 2.80 2.75 80 0.10 0. TDA8007B MAX. UNIT 6 V 350 300 mA 5.25 V 5.4 V 3. ...
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... AND CONVERTER SUPERVISOR ISO7816 UART ANALOG DRIVERS AND SEQUENCERS TIMEOUT COUNTER CLOCK CIRCUIT INT OSC TDA8007B XTAL OSC 47 XTAL1 Fig.1 Block diagram. 4 Objective specification TDA8007B 220 nF SBP SBM AGND 220 nF 6 C41 4 C81 8 CLK1 10 RST1 9 V CC1 3 ...
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... D4 32 data 4 input/output or address 4 input D5 33 data 5 input/output or address 5 input D6 34 data 6 input/output or address 6 input D7 35 data 7 input/output or address 7 input RD 36 read selection signal input (read or write in non-multiplexed configuration) (active LOW) 1999 Nov 11 DESCRIPTION 5 Objective specification TDA8007B ...
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... RSTOUT 1 I/OAUX 2 I/O1 3 C81 4 5 PRES1 C41 6 GNDC1 7 8 CLK1 V CC1 9 RST1 10 I/O2 11 C82 12 1999 Nov 11 DESCRIPTION TDA8007B Fig.2 Pin configuration. 6 Objective specification TDA8007B in non-multiplexed SAM 25 AGND FCE535 ...
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... 2.5 scale (1) ( 0.27 0.18 7.1 7.1 9.15 0.5 0.17 0.12 6.9 6.9 8.85 REFERENCES JEDEC EIAJ detail 9.15 0.75 1.0 0.2 0.12 0.1 8.85 0.45 EUROPEAN PROJECTION Objective specification TDA8007B SOT313 (1) ( 0.95 0. 0.55 0.55 0 ISSUE DATE 94-12-19 97-08-01 ...
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... Use a low voltage ( less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds 300 C. When using a dedicated tool, all other leads can be soldered in one operation within seconds between 270 and 320 C. 8 Objective specification TDA8007B ...
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... Philips for any damages resulting from such improper use or sale. 1999 Nov 11 SOLDERING METHOD WAVE not suitable (2) not suitable suitable (3)(4) not recommended (5) not recommended 9 Objective specification TDA8007B (1) REFLOW suitable suitable suitable suitable suitable ...
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... Philips Semiconductors Multiprotocol smart card interface 1999 Nov 11 NOTES 10 Objective specification TDA8007B ...
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... Philips Semiconductors Multiprotocol smart card interface 1999 Nov 11 NOTES 11 Objective specification TDA8007B ...
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... Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel ...