IRKC56/06A International Rectifier Corp., IRKC56/06A Datasheet

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IRKC56/06A

Manufacturer Part Number
IRKC56/06A
Description
ADD-A-pak GEN V Power Modules
Manufacturer
International Rectifier Corp.
Datasheet
www.irf.com
STANDARD DIODES
The Generation V of Add-A-pak module combine the
excellent thermal performance obtained by the usage
of Direct Bonded Copper substrate with superior
mechanical ruggedness, thanks to the insertion of a
solid Copper baseplate at the bottom side of the device.
The Cu baseplate allow an easier mounting on the
majority of heatsink with increased tolerance of surface
roughness and improve thermal spread.
The Generation V of AAP module is manufactured
without hard mold, eliminating in this way any possible
direct stress on the leads.
Mechanical Description
Major Ratings and Characteristics
Parameters
I
I
I
I
I
V
T
T
F(AV)
F(RMS)
FSM
2
2
High Voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500V
Features
J
STG
RRM
t @ 50Hz
t
@ 100°C
@ 50Hz
@ 60Hz
@ 60Hz
range
RMS
isolating voltage
IRK.56
12.89
11.76
128.9
1600
1680
60
94
400 to 1600
- 40 to 150
- 40 to150
IRK.71
15.90
14.53
1790
1870
126
159
80
KA
Units
KA
KA
o
o
A
V
A
A
A
C
C
2
2
2
s
s
s
Benefits
Up to 1600V
Full compatible TO-240AA
High Surge capability
Easy Mounting on heatsink
Al
Heatsink grounded
These modules are intended for general purpose high
voltage applications such as high voltage regulated power
supplies, lighting circuits, temperature and motor speed
control circuits, UPS and battery charger.
The electrical terminals are secured against axial pull-out:
they are fixed to the module housing via a click-stop
feature already tested and proved as reliable on other IR
modules.
Electrical Description
2
ADD-A-pak
0
3
IRK.56, .71 SERIES
DBC insulator
TM
Bulletin I27140 rev. E 10/02
GEN V Power Modules
60 A
80 A
1

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IRKC56/06A Summary of contents

Page 1

STANDARD DIODES Features High Voltage Industrial Standard Package Thick Al metal die and double stick bonding Thick copper baseplate UL E78996 approved 3500V isolating voltage RMS Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained ...

Page 2

IRK.56, .71 Series Bulletin I27140 rev. E 10/02 ELECTRICAL SPECIFICATIONS Voltage Ratings Voltage V , maximum repetitive RRM Type number Code peak reverse voltage IRK.56/ . Forward Conduction Parameter IRK.56 I Max. average ...

Page 3

Thermal and Mechanical Specifications Parameter IRK.56 T Junction temperature range J T Storage temperature range stg R Max. thermal resistance, thJC junction to case R Typical thermal resistance, thCS case to heatsink T Mounting tourque ±10% to heatsink busbar wt ...

Page 4

IRK.56, .71 Series Bulletin I27140 rev. E 10/02 Outline Table Dimensions are in millimeters and [inches] IRKD IRKE ( (2) - (3) NOTE: To order the Optional Hardware see Bulletin I27900 4 Circuit Configuration Table IRKC IRKJ (1) ...

Page 5

IRK.56.. Series R (DC) = 0.5 K/W thJC 140 130 Conduction Angle 120 110 90° 100 60° 30° Average Forward Current (A) Fig Current Ratings Characteristics 90 180° 120° 80 ...

Page 6

IRK.56, .71 Series Bulletin I27140 rev. E 10/02 120 100 80 180° (Sine Total RMS Output Current (A) 450 400 350 300 250 200 150 100 Single Phase Bridge ...

Page 7

IRK.71.. Series R (DC) = 0.4 K/W thJC 140 130 Conduction Angle 120 110 30° 100 60° 90° Average Forward Current (A) Fig Current Ratings Characteristics 120 180° 120° ...

Page 8

IRK.56, .71 Series Bulletin I27140 rev. E 10/02 160 140 120 180° 100 (Sine Total RMS Output Current (A) 600 500 400 300 200 100 Total Output ...

Page 9

T = 25° 150°C J IRK.56.. Series Per Junction 10 0.5 1 1.5 2 2.5 Instantaneous Forward Voltage (V) Fig Forward Voltage Drop Characteristics 1 Steady State Value 0.5 K/W thJC ...

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