LTC1541CMS8 Linear Technology, LTC1541CMS8 Datasheet - Page 11

• Manufacturer Part Number: LTC1541CMS8
• Description: IC OPAMP/COMP/REF MICRPWR 8MSOP
• Manufacturer: Linear Technology
• Type: Amplifier, Comparator, Referencer

Specifications of LTC1541CMS8

• Applications: General Purpose
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

PACKAGE DESCRIPTIO
.245
MIN
RECOMMENDED SOLDER PAD LAYOUT
.050 BSC
.030 ±.005
TYP
3.5 ±0.05
(.0165 ± .0015)
0.42 ± 0.038
2.15 ±0.05
TYP
RECOMMENDED SOLDER PAD LAYOUT
(.206)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
5.23
MIN
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
.045 ±.005
.160 ±.005
1.65 ±0.05
(2 SIDES)
0.28 ± 0.05
(0.203 – 0.254)
.008 – .010
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
2.38 ±0.05
(2 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
(0.254 – 0.508)
0.889 ± 0.127
(.0256)
(.035 ± .005)
(.126 – .136)
0.65
3.20 – 3.45
BSC
.010 – .020
0.50
BSC
(0.406 – 1.270)
(MILLIMETERS)
U
.016 – .050
8-Lead Plastic Small Outline (Narrow .150 Inch)
INCHES
0.675 ±0.05
× 45°
PACKAGE
OUTLINE
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1660)
GAUGE PLANE
(.007)
(Reference LTC DWG # 05-08-1698)
0.18
(Reference LTC DWG # 05-08-1610)
0°– 8° TYP
8-Lead Plastic MSOP
TOP MARK
MS8 Package
0.254
(.010)
PIN 1
DD Package
0.200 REF
S8 Package
(1.346 – 1.752)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
(0.355 – 0.483)
.053 – .069
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
.014 – .019
DETAIL “A”
TYP
DETAIL “A”
0° – 6° TYP
0.53 ± 0.152
(.021 ± .006)
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
SEATING
PLANE
0.00 – 0.05
(1.270)
.050
BSC
(0.101 – 0.254)
4.90 ± 0.152
(.193 ± .006)
(.118 ± .004)
3.00 ± 0.102
(.009 – .015)
.004 – .010
0.22 – 0.38
(NOTE 3)
TYP
LTC1541/LTC1542
1.65 ± 0.10
(2 SIDES)
(.043)
MAX
(5.791 – 6.197)
1.10
.228 – .244
(.0256)
0.65
BSC
1
BOTTOM VIEW—EXPOSED PAD
8
0.28 ± 0.05
R = 0.115
7 6 5
2 3
TYP
4
5
2.38 ±0.10
(2 SIDES)
4
1
8
(4.801 – 5.004)
(.118 ± .004)
3.00 ± 0.102
.189 – .197
(.0205)
(.034)
7
2
(NOTE 4)
0.52
0.86
REF
REF
0.127 ± 0.076
NOTE 3
(.005 ± .003)
8
1
MSOP (MS8) 0204
0.50 BSC
0.38 ± 0.10
6
3
(DD8) DFN 0203
5
4
(3.810 – 3.988)
11
.150 – .157
NOTE 3
15412fd
SO8 0303