AS2535F Austria Mikro Systeme International AG, AS2535F Datasheet
AS2535F
Related parts for AS2535F
AS2535F Summary of contents
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Multi-Standard CMOS Telephone IC for Basic Telephones AS2533-36 General Description The AS253x is a CMOS integrated circuit that contains all the functions needed to build a high performance electronic telephone set with basic features. The AS253x incorporates a line interface, ...
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Data Sheet AS2533-36 Pin Description Pin # Symbol 4 V Positive Voltage Supply DD This is the supply pin for the circuit nalog round GND This is the analogue ground for the amplifiers. 6 STB S ...
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Data Sheet AS2533-36 Pin # Symbol 17 R4 Keyboard Rows 18 R3 (see key arrangements in Figure 2, Figure 3 and Figure FCI F C requency omparator This is a Schmitt trigger input for ...
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Data Sheet AS2533-36 Functional Description Keyboard Connections Key closure, R max kΩ ON Key open, R min MΩ OFF ...
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Data Sheet AS2533-36 Keyboard Connections continued ...
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Data Sheet AS2533-36 Transmit The gain of the transmit path for 600 Ω line termination from M1/ (see test circuit Figure 9). The microphone input is differential with an input impedance of 20 kΩ. The ...
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Data Sheet AS2533-36 Last Number Redial LNR is a facility that allows resignalling of the last manually dialed number without keying in all the digits again. The LNR is repeatable after each off-hook. The current content of the RAM is ...
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Data Sheet AS2533-36 Low group Digit 1-2-3-A 697 Hz Digit 4-5-6-B 770 Hz Digit 7-8-9-C 852 Hz Digit * -0-# -D 941 Hz High group Digit 1-4-7- * 1209 Hz Digit 2-5-8-0 1336 Hz Digit 3-6-9-# 1477 Hz Digit A-B-C-D ...
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Data Sheet AS2533-36 Typical Characteristics of Line Loss Compensation (dB) Tx Gain 35 34 LLC = 800 600Ω LINE -10 dBm Figure 6 Typical ...
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Data Sheet AS2533-36 Typical Application Complex Impedance (270 W + 750 W // 150 nF) Only the components necessary for presenting the complete functions of the AS253x are included. The external components might change to comply with various national PTT ...
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Data Sheet AS2533-36 Programming Procedures Procedure Principles The procedures for utilizing the features of the AS253x are optimized out of consideration for the human factor in order to: meet the user’s expectations - be easy to learn and relearn - ...
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Data Sheet AS2533-36 Timing Diagrams LD Dialing MUTE MASK HS/DPN t IDP t PDP LD Dialing with Access Pause MUTE MASK HS/DPN t t IDP B t PDP MF Dialing MUTE HS/DPN ITP Revision 8.8 t ...
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Data Sheet AS2533-36 Flash MUTE MASK HS/DPN Repeat Dialing (not AS2535) Number engaged RP key MUTE DIALLING HS/DPN Power Down Revision 8 PFP M M New connection austriamicrosystems t ...
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Data Sheet AS2533-36 Electrical Characteristics Absolute maximum ratings Positive Supply Voltage Input Current Input Voltage (LS) Input Voltage (LI, CS) Input Voltage (STB, RI) Input Voltage (MO) Digital Input Voltage Electrostatic Discharge (HBM 1.5kΩ-100pF) Storage Temperature Recommended operating conditions Supply ...
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Data Sheet AS2533-36 AC Characteristics (I LINE = 15 mA 800 Hz unless otherwise specified) Symbol Parameter Tx Transmit A Gain, Transmit TX Variation with Frequency ΔA TX/F THD Distortion V Soft Clip Level AGC A Soft Clip ...
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Data Sheet AS2533-36 AC Characteristics (cont´ mA 800 Hz unless otherwise specified LINE Symbol Parameter Keyboard Key Debounce Time t D HS/DPN Input Low to High Debounce t HS-L High to Low Debounce t HS-H ...
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Data Sheet AS2533-36 Symbol Parameter t Flash Duration 1 FD Flash Duration 2 Flash Duration 3 t Post Flash Pause PFP t Access Pause AP t Repeat Break Time RP Tone Ringer V Melody Output MO t Melody Delay MD ...
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Data Sheet AS2533-36 Test Circuit Revision 8.8 austriamicrosystems Figure 9 Test Circuit Page ...
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Data Sheet AS2533-36 Characteristic Curves (Typical) 1,2 soft clipping [Vp] 1,0 0,8 Line Current: 20mA Frequency: 800Hz Tamb: 25°C 0,6 Typically 0,4 0,2 0,0 0,00 0,25 0,50 0,75 1,00 1,25 Line Input Voltage (LS) Figure 10 Receive Soft Clipping and ...
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Data Sheet AS2533-36 Bond Pad Layout Bond Options Product Version AS2533 AS2534/34R (1) AS2535 AS2536 (1) For deliveries as packaged devices (SOIC28), LNR only is tested, direct and indirect memories are not tested! Revision 8.8 Bond Pad Connection BOND_AS2535 not ...
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Data Sheet AS2533-36 Sizes and Coordinates Die Size: 3.190mm x 2.975mm Bond Pad Size: 85µm x 85µm Bond Pad Co-ordinates: Reference co-ordinate of DIE = DIE center Reference co-ordinate of PAD = PAD center X y [µm] [µm] Pad Name ...
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Data Sheet AS2533-36 Vertical Structure of Bond Pads Process CXQ/CXB – FAB B General Conditions Passivation 200 nm silicon oxynitride + 550 nm silicon nitride Marking of Failure Dice Ink Dots, water resistant, Diameter 0.4...1.2 mm Allowed Loss after Assembly ...
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Data Sheet AS2533-36 Conditions for Delivery as Dice on Foil, sawn Die thickness 380 ± 20µm Back finishing back grinding, silicon Frame Material: Plastic Size: see figure Frame Position Tolerance Center wafer to frame: ± 4mm Angle deviation wafer to ...
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Data Sheet AS2533-36 Packaging The device is available in the packages outlined below (not to scale). For exact mechanical package dimensions please see austriamicrosystems packaging information. AG 28-pin plastic SOIC (suffix T) Max. Body Length 18.1mm / 713mil Max. Body ...
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Data Sheet AS2533-36 Contact Information austriamicrosystems AG Business Unit Communications A 8141 Schloss Premstaetten, Austria-EU T. +43 (0) 3136 500 0 F. +43 (0) 3136 500 5692 http://www.austriamicrosystems.com For Sales Offices, Distributors and Representatives, please visit: http://www.austriamicrosystems.com/contact Copyright Copyright © ...