MSM7512BGS-K Oki Semiconductor, MSM7512BGS-K Datasheet

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MSM7512BGS-K

Manufacturer Part Number
MSM7512BGS-K
Description
1200 bps half duplex FSK modem - ITU-T V.23
Manufacturer
Oki Semiconductor
Datasheet

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E2A0014-16-X0
¡ Semiconductor
MSM7512B
1200 bps Half Duplex FSK Modem – ITU-T V.23
GENERAL DESCRIPTION
The MSM7512B is useful for the ITU-T V.23 modem, for examples, low cost built-in modems,
telecontrol systems, home security systems, etc.
The family version, MSM7510 for ITU-T V.21, will be available following this device.
Oki has been mass-producing and delivering the MSM6926 and 6927 for a long time, but these
devices need two power supplies, +5 V for digital and +12 V for analog.
New generation devices, MSM7510/7512B, work with single rail +3 V to +5 V and low power
consumption.
FEATURES
• Conforms to ITU-T V.23, 1200 bps Half Duplex
• Conforms to ITU-T V.23, 75 bps transmitter
• Single Power Supply: +3 V to +5 V
• Low Power Consumption
• Line Hybrid Circuit on Chip
• Line Direct Drive Capability of Analog Output
• 3.579545 MHz Crystal Oscillator
• Digital Interface:
• Package options:
Operating Mode:
Power Down Mode:
16-pin plastic DIP
24-pin plastic SOP
Semiconductor
(DIP16-P-300–2.54)
(SOP24-P-430-1.27–K)
25 mW Typ.
0.1 mW Max.
TTL
(Product name: MSM7512BRS)
(Product name: MSM7512BGS-K)
Previous version: Nov. 1996
This version: Jan. 1998
MSM7512B
1/12

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MSM7512BGS-K Summary of contents

Page 1

... Line Direct Drive Capability of Analog Output • 3.579545 MHz Crystal Oscillator • Digital Interface: TTL • Package options: 16-pin plastic DIP (DIP16-P-300–2.54) 24-pin plastic SOP (SOP24-P-430-1.27–K) This version: Jan. 1998 Previous version: Nov. 1996 (Product name: MSM7512BRS) (Product name: MSM7512BGS-K) MSM7512B 1/12 ...

Page 2

Semiconductor BLOCK DIAGRAM AI + (2) – *R1 *R1 *R2 *R2 AO (3) EAI (4) X1 (6) OSC X2 (7) CLK ( (1) GND (5) FSK & ANS Bandpass AOG Filter *R3 – *R2 + CLK GEN. SG ...

Page 3

Semiconductor PIN CONFIGURATION (TOP VIEW EAI 4 GND CLK 8 16-Pin Plastic DIP 16 AOG MOD2 MOD1 NC 4 ...

Page 4

Semiconductor PIN DESCRIPTION No. Name I/O RS GS- — EAI GND — CLK ...

Page 5

Semiconductor ABSOLUTE MAXIMUM RATINGS Parameter Power Supply Voltage Input Voltage Storage Temperature RECOMMENDED OPERATING CONDITIONS Parameter Power Supply Voltage Operating Temperature Input Clock Frequency V Bypass Capacitor DD Oscillation Frequency Frequency Deviation Temperature Characteristics Equivalent Series Resistance Load Capacitance ELECTRICAL ...

Page 6

Semiconductor AC Characteristics Modulator/analog output (AO) characteristics Parameter Symbol f DM FSK Transmit f DS Signal Frequency FSK Transmit Signal V AO1 Answer Tone amplitude V AO2 Analog External V EA1 Input Signal Gain V EA2 ...

Page 7

Semiconductor Demodulator analog input (Al, EAI) characteristics Parameter Symbol Receive Signal V AI Amplitude Receive Signal V ON Detect Amplitude (CD) V OFF Hysteresis (CD) V HYS CD Delay Time t CDD CD Hold Time t CDH Receive Data (RD) ...

Page 8

Semiconductor OPERATION MODE MOD2 MOD1 Receive Filter Phone SG Line AO Transmit Filter AI Receive Filter Phone Line AO Transmit Filter AI Receive Filter Phone Line AO Transmit Filter SG Figure ...

Page 9

Semiconductor APPLICATION CIRCUIT 2.2 mF 600 W : 600 W Line 2.2 mF 600 W : 600 W Line External Clock 3.58 MHz MSM7512BRS 1 V AOG DD AI MOD2 AO MOD1 600 W TEST EAI RS GND 10 mF ...

Page 10

Semiconductor An Example of the External Adjustment for a transmitting Level and detecting Level If you desire to change the transmitting level or detecting level, adjust the external circuit by referring to the following circuit VAOL – + ...

Page 11

Semiconductor PACKAGE DIMENSIONS DIP16-P-300-2.54 MSM7512B (Unit : mm) Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating Solder plate thickness more Package weight (g) 0.99 TYP. 11/12 ...

Page 12

Semiconductor SOP24-P-430-1.27-K Mirror finish Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in ...

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