650231-1 TE Connectivity, 650231-1 Datasheet - Page 3

650231-1

Manufacturer Part Number
650231-1
Description
Manufacturer
TE Connectivity
Datasheets

Specifications of 650231-1

Number Of Dual Positions
120
Termination Method To Pc Board
Through Hole - Solder
Bus Type
PS/2
Pcb Mount Alignment Type
2 Pylons
Termination Post Length (mm [in])
3.56 [0.140]
Solder Tail Contact Plating
Tin-Lead
Centerline (mm [in])
1.27 [0.050]
Contact Base Material
Phosphor Bronze
Contact Plating, Mating Area, Material
Gold (30)
Underplate Material
Nickel
Mating Alignment Type
1 Key/1 Web
Housing Material
High Temperature Thermoplastic
Housing Color
Brown
Rohs/elv Compliance
ELV compliant, 5 of 6 Compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Unm ating force.
Therm al shock.
Hum idity/tem perature cycling.
Tem perature life.
Mixed flowing gas.
Rev D
NOTE
Test Description
Shall meet visual requirements, show no physical damage and shall meet requirements of
additional tests as specified in Test Sequence in Figure 2.
0.5 ounce m inim um per contact
pair.
See Note.
See Note.
See Note.
See Note.
ENVIRONMENTAL
Figure 1 (end)
Requirem ent
TE Spec 109-35.
Measure force necessary to unm ate
printed circuit board from sam ples
at m axim um rate of .5 inch per
m inute.
TE Spec 109-22.
Subject unm ated sam ples to 5
cycles between -55 and 85°C.
TE Spec 109-23-3, Condition B.
Subject unm ated sam ples to 10
cycles between 25 and 65°C at 95%
RH.
TE Spec 109-43.
Subject m ated sam ples to
tem perature life at 85°C for 1000
hours.
TE Spec 109-85-2.
Subject m ated sam ples to
environm ental class II for 14 days.
Procedure
108-14034
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