AT32UC3B164 Atmel Corporation, AT32UC3B164 Datasheet - Page 55
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AT32UC3B164
Manufacturer Part Number
AT32UC3B164
Description
Manufacturer
Atmel Corporation
Datasheets
1.AT32UC3A0128.pdf
(377 pages)
2.AT32UC3A0128.pdf
(33 pages)
3.AT32UC3A0128.pdf
(159 pages)
4.AT32UC3B0128.pdf
(684 pages)
5.AT32UC3B0128.pdf
(107 pages)
Specifications of AT32UC3B164
Flash (kbytes)
64 Kbytes
Pin Count
48
Max. Operating Frequency
60 MHz
Cpu
32-bit AVR
# Of Touch Channels
32
Hardware Qtouch Acquisition
No
Max I/o Pins
28
Ext Interrupts
28
Usb Transceiver
1
Usb Speed
Full Speed
Usb Interface
Device
Spi
3
Twi (i2c)
1
Uart
2
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
6
Adc Resolution (bits)
10
Adc Speed (ksps)
384
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
16
Self Program Memory
YES
Dram Memory
No
Nand Interface
No
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
3.0-3.6 or (1.65-1.95+3.0-3.6)
Operating Voltage (vcc)
3.0-3.6 or (1.65-1.95+3.0-3.6)
Fpu
No
Mpu / Mmu
Yes / No
Timers
10
Output Compare Channels
16
Input Capture Channels
6
Pwm Channels
13
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT32UC3B164-Z1UT
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
10. Mechanical Characteristics
10.1
10.1.1
10.1.2
32059L–AVR32–01/2012
Thermal Considerations
Thermal Data
Junction Temperature
Table 10-1
Table 10-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
page
Table 10-1 on page
Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
55.
=
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
55.
JA
)
42.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Package
TQFP64
TQFP64
TQFP48
TQFP48
Table 10-1 on
49.6
13.5
51.1
13.7
Typ
”Power
J
⋅ C/W
⋅ C/W
in °C.
Unit
55