ATmega325PA Atmel Corporation, ATmega325PA Datasheet - Page 2

• Manufacturer Part Number: ATmega325PA
• Manufacturer: Atmel Corporation

1. Pin Configurations
1.1
Figure 1-1.
Note:
8285DS–AVR–06/11
(USCK/SCL/PCINT4) PE4
(XCK/AIN0/PCINT2) PE2
Pinout - TQFP and QFN/MLF
The large center pad underneath the QFN/MLF packages is made of metal and internally connected to GND. It should be sol-
dered or glued to the board to ensure good mechanical stability. If the center pad is left unconnected, the package might loosen
from the board.
(DI/SDA/PCINT5) PE5
(OC0A/PCINT12) PB4
(OC1A/PCINT13) PB5
(OC1B/PCINT14) PB6
(MOSI/PCINT10) PB2
(MISO/PCINT11) PB3
(CLKO/PCINT7) PE7
(AIN1/PCINT3) PE3
(RXD/PCINT0) PE0
(TXD/PCINT1) PE1
(SCK/PCINT9) PB1
(DO/PCINT6) PE6
(SS/PCINT8) PB0
64A (TQFP)and 64M1 (QFN/MLF) Pinout
ATmega165A/ATmega165PA/ATmega325A/ATmega325PA/ATmega645A/ATmega645P
ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P
DNC
10
11
14
15
16
12
13
1
2
3
4
5
6
7
8
9
INDEX CORNER
39
38
35
34
33
48
47
46
45
44
43
42
41
40
37
36
PA3
PA4
PA5
PA6
PA7
PG2
PC7
PC5
PC4
PC3
PC2
PC1
PC0
PC6
PG1
PG0
2