DAC08 Analog Devices, DAC08 Datasheet - Page 5

• Manufacturer Part Number: DAC08
• Description: 8-Bit, High Speed, Multiplying D/A Converter (Universal Digital Logic Interface)
• Manufacturer: Analog Devices

Specifications of DAC08

• Resolution (bits): 8bit
• Dac Update Rate: 11.8MSPS
• Dac Settling Time: 85ns
• Max Pos Supply (v): +18V
• Single-supply: No
• Dac Type: Current Out
• Dac Input Format: Par

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Operating Temperature
Junction Temperature (T
Storage Temperature Q Package
Storage Temperature P Package
Lead Temperature (Soldering, 60 sec)
V+ Supply to V− Supply
Logic Inputs
V
Analog Current Outputs (at V
Reference Input (V
Reference Input Differential Voltage
Reference Input Current (I
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
LC
DAC08AQ, DAC08Q
DAC08HQ, DAC08EQ, DAC08CQ,
DAC08HP, DAC08EP
DAC08CP, DAC08CS
(V
14
to V
15
)
14
to V
15
J
)
)
14
)
S−
= 15 V)
Rating
−55°C to +125°C
0°C to +70°C
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
−65°C to +125°C
300°C
36 V
V− to V− + 36 V
V− to V+
4.25 mA
V− to V+
±18 V
5.0 mA
Rev. C | Page 5 of 20
Package Type
16-Lead CERDIP (Q)
16-Lead PDIP (P)
20-Terminal LCC (RC)
16-Lead SOIC (S)
1
Stresses greater than those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
θ
device in socket for CERDIP, PDIP, and LCC packages; θ
device soldered to printed circuit board for SOIC package.
JA
is specified for worst-case mounting conditions, that is, θ
θ
100
82
76
111
JA
1
JA
θ
16
39
36
35
is specified for
JC
JA
is specified for
DAC08
Unit
°C/W
°C/W
°C/W
°C/W