5-2007615-5 TE Connectivity, 5-2007615-5 Datasheet - Page 5

• Manufacturer Part Number: 5-2007615-5
• Manufacturer: TE Connectivity

Specifications of 5-2007615-5

• Solder Ball: Tin-Silver
• Product Height: 5mm
• Number Of Positions: 200
• Vacuum Cover: With
• Contact Type: Socket
• Contact Base Material: Copper Alloy
• Contact Finish: Gold (30) over Nickel (50)
• Connector Style: Receptacle
• Housing Material: Thermoplastic - GF
• Stack Height (mm [in]): 15.00 [0.591], 17.00 [0.669], 18.00 [0.709], 20.00 [0.787], 25.00 [0.984], 30.00 [1.181]
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Packaging Method: Hard Tray

Mixed flowing gas.
Dust.
Rev B
NOTE
Test Description
Shall meet visual requirements, show no physical damage, and meet requirements of additional
tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure
2.
See Note.
See Note.
Figure 1 (end)
Requirement
EIA-364-65, Class IIA (4 gas).
Subject mated and mounted
specimens to environmental Class
IIA for 20 days. After initial LLCR
and 50% durability cycles,
specimens shall be broken into 2
groups of 5. The plugs from the first
group and the receptacles from the
second group, shall be placed in the
chamber unmated for 10 days. After
5 days unmated exposure, mate
and recheck LLCR, then unmate
and finish initial 10 days. Mate,
recheck LLCR and then leave in
chamber for 10 days mated. After 5
days mated exposure, recheck
LLCR, and then return to chamber
for final 5 days mated exposure.
Subject unmated specimens to dust
exposure for 1 hour at a flow rate of
300 cfm. Dust composition shall be
#1 Benign. Use 9 grams of dust for
each cubic foot of chamber space.
Dry dust for 1 hour at 50
application to connector. After
exposure, let specimens sit for 1
hour in chamber.
Procedure
/
108-2143
C prior to
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