BTA2008W-600D NXP Semiconductors, BTA2008W-600D Datasheet - Page 6

• Manufacturer Part Number: BTA2008W-600D
• Description: Planar passivated high commutation three quadrant triac in a SOT223 surface mountable plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
5. Thermal characteristics
Table 5.
BTA2008W-600D
Product data sheet
Symbol
R
R
Fig 6.
th(j-sp)
th(j-a)
All dimensions are in mm
Minimum footprint SOT223
Thermal characteristics
Parameter
thermal resistance from
junction to solder point
thermal resistance from
junction to ambient
min
min
1.5
1.5
(3×)
min
1.5
3.8 min
4.6
2.3
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All information provided in this document is subject to legal disclaimers.
Conditions
full cycle; see
in free air; printed-circuit board mounted:
minimum footprint; full cycle; see
in free air; printed-circuit board mounted:
pad area; full cycle; see
6.3
Rev. 1 — 7 July 2011
Figure 8
Fig 7.
Figure 7
(35 um thick)
All dimensions are in mm
Printed circuit board:
FR4 epoxy glass (1.6 mm thick), copper laminate
Printed circuit board pad area: SOT223
60
Figure 6
10
9
BTA2008W-600D
4.6
Min
-
-
-
36
15
50
7
Typ
-
156
70
© NXP B.V. 2011. All rights reserved.
3Q Hi-Com Triac
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Max
15
-
-
4.5
18
Unit
K/W
K/W
K/W
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