BAP50-04 NXP Semiconductors, BAP50-04 Datasheet - Page 2
BAP50-04
Manufacturer Part Number
BAP50-04
Description
Two planar PIN diodes in series configuration in an SOT23 small plastic SMD package
Manufacturer
NXP Semiconductors
Datasheet
1.BAP50-04.pdf
(8 pages)
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NXP Semiconductors
FEATURES
Two elements in series configuration in a small-sized
Low diode capacitance
Low diode forward resistance.
APPLICATIONS
General RF applications.
DESCRIPTION
Two planar PIN diodes in series configuration in an SOT23
small plastic SMD package.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
1999 Dec 03
Per diode
V
I
P
T
T
SYMBOL
F
plastic SMD package
stg
j
R
tot
General purpose PIN diode
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
PARAMETER
T
s
= 90 C
2
PINNING
handbook, halfpage
CONDITIONS
Marking code: 4Lp.
Fig.1 Simplified outline (SOT23) and symbol.
2
PIN
1
2
3
3
1
anode
cathode
common connection
65
65
MIN.
Product specification
2
DESCRIPTION
50
50
250
+150
+150
BAP50-04
MAX.
3
V
mA
mW
C
C
MAM232
UNIT
1