BAP64-03 NXP Semiconductors, BAP64-03 Datasheet - Page 2

Planar PIN diode in a SOD323 very small plastic SMD package

BAP64-03

Manufacturer Part Number
BAP64-03
Description
Planar PIN diode in a SOD323 very small plastic SMD package
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
FEATURES
 High voltage, current controlled
 RF resistor for RF attenuators and switches
 Low diode capacitance
 Low diode forward resistance
 Low series inductance
 For applications up to 3 GHz.
APPLICATIONS
 RF attenuators and switches.
DESCRIPTION
Planar PIN diode in a SOD323 very small plastic SMD
package.
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
2004 Feb 11
BAP64-03
V
I
P
T
T
F
stg
j
R
tot
Silicon PIN diode
NUMBER
SYMBOL
TYPE
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
NAME
PARAMETER
plastic surface mounted package; 2 leads
T
s
= 90 C
2
DESCRIPTION
PINNING
PACKAGE
CONDITIONS
Marking code: A3.
The marking bar indicates the cathode.
Fig.1 Simplified outline (SOD323) and symbol.
1
PIN
1
2
2
65
65
cathode
anode
MIN.
Product specification
DESCRIPTION
175
100
500
+150
+150
BAP64-03
MAX.
sym006
VERSION
SOD323
V
mA
mW
C
C
UNIT

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