1-1734081-4 TE Connectivity, 1-1734081-4 Datasheet

1-1734081-4

Manufacturer Part Number

1-1734081-4

Description

Manufacturer

TE Connectivity

Series

Datasheets

1.1-1734081-1.pdf (19 pages)

2.1-1734081-1.pdf (5 pages)

Specifications of 1-1734081-4

Size

Standard

Gender

Receptacle

Number Of Ports

Orientation

Right Angle

Mount Location

Top

Termination Method

Solder

Tail Length (mm [in])

2.25 [0.089]

Locking Feature

Without

Led

Without

Panel Ground

Without

Pcb Mount Retention Type

Straight Leg

Shell Plating

Nickel over Copper

Assembly Process Feature

Without Pick and Place Cover

Locating Post(s)

Without

Number Of Positions

Contact Termination Type

Through Hole

Contact Plating, Mating Area, Material

Gold

Contact Plating, Mating Area, Thickness (µm [?in])

0.762 [30]

Housing Color

Gray

Industry Standard

USB 2.0

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C

Rohs/elv Compliance History

Always was RoHS compliant

Usb-if Test Id Number (tid)

Not Submitted For Testing

Applies To

Printed Circuit Board

Pcb Thickness, Recommended (mm [in])

1.40 – 1.60 [0.055 – 0.063]

Packaging Method

Tape & Reel

Current page: 1 of 5
Download datasheet (142Kb)

1. SCOPE

2. APPLICABLE DOCUMENT

3. REQUIREMENTS

Scott Chien

Corporation

Taipei, Taiwan

All International Rights

Reserved.

1.1. CONTENTS

1.2. QUALIFICATION

A SERIES.

specifications shall be used. All inspections shall be performed using the applicable inspection plan

and product drawing.

otherwise specified, the latest edition of the document applies. In the event of conflict between the

requirements of this specification and the product drawing, the product drawing shall take precedence.

In the event of conflict between the requirements of this specification and the referenced documents,

this specification shall take precedence.

This specification covers the performance, tests and quality requirements for the

When tests are performed on the subject product line, the procedures specified in TE 109 series

The following TE documents form a part of this specification to the extent specified herein. Unless

2.1. TYCO ELECTRONICS SPECIFICATIONS

3.1. DESIGN AND CONSTRUCTION

3.2. MATERIALS

3.3. RATINGS

A. 109-1: General Requirements for Test Specifications

B. 109-197：TE Specification vs EIA and IEC Test Methods

C. 501-57579：Test Report

A. Housing：Thermoplastic, UL94V-0

B. Contact：Copper Alloy, Gold plating on contact area, Tin Plating on soldertail over Nickel

C. Shield：Copper Alloy, Gold plating on contact area, Tin Plating on soldertail over Nickel

A. Voltage: 30 VAC rms.

B. Current: 1.5 A Max

C. Temperature : -40℃ to 80℃

501-57796：Test Report(For PN1775727-X)

Product shall be of the design, construction and physical dimensions specified on the

applicable product drawing.

underplating overall.

underplating overall

* Trademark

│ Indicates change

Product

Specification

USB CONNECTOR, A SERIES

For latest revision, visit our website at www.tycoelectronics.com\documents.

For Regional Customer Service, visit our website at www.tycoelectronics.com

02-Oct-2008

DATE

APVD

William Kodama

USB CONNECTOR,

02-Oct-2008 Rev B

108-57505

LOC DW

02-Oct-2008

1 of 5

DATE

Related parts for 1-1734081-4

1-1734081-4 Summary of contents

Page 1

... This specification covers the performance, tests and quality requirements for the A SERIES. 1.2. QUALIFICATION When tests are performed on the subject product line, the procedures specified in TE 109 series specifications shall be used. All inspections shall be performed using the applicable inspection plan and product drawing. ...

Page 2

... PERFORMANCE REQUEIREMENT AND TEST DESCRIPTION The product shall be designed to meet the electrical, mechanical and environmental performance requirements specified in Figure 1. All tests shall be performed at ambient environmental conditions per TE specification 109-1 test requirements and procedure summary. 3.5. TEST REQUIREMENTS AND PROCEDURES SUMMARY TEST ITEM ...

Page 3

... Pre Heat：150~180℃, 90±30sec. Heat：230℃ Min., 30±10sec. Peak Temp.：245+0/-5℃, 10~30sec. Duration：3 cycles TE spec. 109-201, Condition A Pre-soak condition, 85 ℃ /85 ﹪ RH for 168 hours. Pre Heat：150~180℃, 90±30sec. Heat：230℃ Min., 30±10sec. Peak Temp.：260+0/-5℃, 20~40sec. ...

Page 4

... Rev B Test Group Test Sequence（a） ...

Page 5

... Figure 3. Contact Resistance Measuring Point Figure 4. Resistance to reflow solder heat Rev B 108-57505 ...

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