1-178314-2 TE Connectivity, 1-178314-2 Datasheet - Page 6

1-178314-2

Manufacturer Part Number
1-178314-2
Description
Manufacturer
TE Connectivity
Datasheets

Specifications of 1-178314-2

Product Type
Connector
Connector Type
Header
Mount
Board Mount
Keyed
Yes
Product Series
D-3100S
Pcb Mounting Orientation
Vertical
Pcb Mount Style
Through Hole
Pcb Mount Retention
With
Keying
X
Voltage Rating (vac)
250
Termination End Plating
Gold over Nickel
Number Of Positions
4
Number Of Rows
1
Centerline, Matrix (mm [in])
3.81 [.150]
Pcb Mount Retention Type
Boardlock(s)
Contact Type
Pin
Contact Plating, Mating Area, Material
Gold (15)
Contact Base Material
Copper Alloy
Connector Style
Plug
Housing Material
Nylon
Ul Flammability Rating
UL 94V-0
Housing Color
Black
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Rohs/elv Compliance History
Converted to comply with RoHS directive
Applies To
Printed Circuit Board
Packaging Quantity
19
Packaging Method
Tube

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
1-178314-2
Manufacturer:
TYCO
Quantity:
56 512
3.5.12 耐久性
3.5.12 Durability
3.5.13 ハウジング ・ ロック強度
3.5.13 Housing Locking Strength
3.5.14 はんだ付け性
3.5.14 Solderability
Rev. J5
Para.
項目
Test Items
試験項目
試験後、総合抵抗(ローレベル)
の条件に合致すること。
Termination Resistance
(Low Level).
シリーズ名
D-3100S
D-3200S
D-3230
D-3100D
D-3200D
D-3400
D-3500
Series
D-3100S
D-3200S
D-3230
D-3100D
D-3200D
D-3400
D-3500
試験面は新鮮なはんだ面が、95
% 以上であること。
Wet Solder Coverage :
95 % Min.
Product Specification
Requirements
Fig.3 (続く)
Fig.3 (CONT.)
製品規格
ロック強度
Strength
N(min)
N 以上
39.2
39.2
147
147
196
147
147
196
98
98
98
98
98
98
毎分 100mmの割合で、コネクタ・アセンブ
リを下記のサイクルで挿入・引抜を繰り返
す。
EIA364-9
100回 : 錫めっき
500回 : 金めっき
Repeat Insertion/extruction of
connector assembly following times at
100mm/min.operation speed.
EIA364-9
100 times : Tin-Plating
500 times : Gold-Plating
ハウジングのロック強度を測定
EIA364-98
Measure Housing locking strength.
EIA364-98
はんだ温度 : 235 ± 5 °C
はんだ浸漬時間 : 5 ± 0.5 s.
EIA364-52
MIL-STD-202 試験法208
Solder Temperature : 235±5℃
Immersion Duration : 5 ± 0.5 s.
EIA364-52
MIL-STD-202 Method 208
Procedures
108-5349
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