MCP6543-I/P Microchip Technology, MCP6543-I/P Datasheet - Page 26

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MCP6543-I/P

Manufacturer Part Number
MCP6543-I/P
Description
IC COMP PUSHPULL 1.6V SNGL 8-DIP
Manufacturer
Microchip Technology
Type
General Purposer
Datasheets

Specifications of MCP6543-I/P

Output Type
CMOS, Push-Pull, Rail-to-Rail, TTL
Package / Case
8-DIP (0.300", 7.62mm)
Number Of Elements
1
Voltage - Supply
1.6 V ~ 5.5 V
Mounting Type
Through Hole
Number Of Channels
1 Channel
Product
Analog Comparators
Response Time
4 us
Offset Voltage (max)
7 mV
Input Bias Current (max)
1 pA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.6 V
Supply Current (max)
1 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MCP6543I/P
MCP6541/1R/1U/2/3/4
DS21696F-page 26
14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
NOTE 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
e
Units
A2
A1
E1
eB
b1
N
D
A
E
b
e
L
c
A2
E1
.015
.290
.240
.735
.008
.045
.014
MIN
.115
.115
L
.100 BSC
INCHES
NOM
.130
.310
.250
.750
.130
.010
.060
.018
14
Microchip Technology Drawing C04-005B
© 2007 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.775
.150
.015
.070
.022
.430
eB
E
c

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