LT6700MPDCB-1#TRMPBF Linear Technology, LT6700MPDCB-1#TRMPBF Datasheet - Page 17

IC COMP DUAL 400MV REF 6-DFN

LT6700MPDCB-1#TRMPBF

Manufacturer Part Number
LT6700MPDCB-1#TRMPBF
Description
IC COMP DUAL 400MV REF 6-DFN
Manufacturer
Linear Technology
Series
Over-The-Top®r
Type
General Purposer
Datasheet

Specifications of LT6700MPDCB-1#TRMPBF

Number Of Elements
2
Output Type
Open Collector
Voltage - Supply
1.4 V ~ 18 V
Mounting Type
Surface Mount
Package / Case
6-WFDFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LT6700MPDCB-1#TRMPBFLT6700MPDCB-1
Manufacturer:
LT
Quantity:
10 000
package inForMaTion
3.55 ±0.05
2.15 ±0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
PIN 1 BAR
1.65 ±0.05
(2 SIDES)
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
2.00 ±0.10
1.35 ±0.05
(2 SIDES)
(2 SIDES)
(Reference LTC DWG # 05-08-1715 Rev A)
6-Lead Plastic DFN (2mm × 3mm)
0.50 BSC
0.75 ±0.05
0.25 ± 0.05
0.70 ±0.05
DCB Package
3.00 ±0.10
(2 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 ± 0.10
R = 0.05
(2 SIDES)
TYP
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
1.35 ±0.10
(2 SIDES)
3
4
6
1
0.50 BSC
LT6700/LT6700HV
0.40 ± 0.10
0.25 ± 0.05
PIN 1 NOTCH
R0.20 OR 0.25
× 45° CHAMFER
(DCB6) DFN 0405

6700123fg

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