322-HCS8P2-100 TE Connectivity, 322-HCS8P2-100 Datasheet
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322-HCS8P2-100
Manufacturer Part Number
322-HCS8P2-100
Description
Manufacturer
TE Connectivity
Specifications of 322-HCS8P2-100
Socket Length (mm [in])
3.56 [0.140]
Sealant
Without
Proprietary Name
HOLTITE
Recommended Hole Size (mm [in])
1.61 [0.0635]
Mating Pin Dia. Range (mm [in])
0.64 – 0.89 [0.025 – 0.035]
Spring Material
Beryllium Copper
Contact Spring Plating
Gold
Contact Base Material
Beryllium Copper
Insertion Method
Hand/Semi-Automatic/Automatic
Government/industry Qualification
No
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Application
Production
Packaging Method
Reel
Packaging Quantity
2,500/Reel