8134-HC-12P3 TE Connectivity, 8134-HC-12P3 Datasheet - Page 5

• Manufacturer Part Number: 8134-HC-12P3
• Manufacturer: TE Connectivity

Specifications of 8134-HC-12P3

• Socket Length (mm [in]): 4.06 [0.160]
• Sealant: Without
• Proprietary Name: HOLTITE
• Recommended Hole Size (mm [in]): 2.08 [0.082]
• Mating Pin Dia. Range (mm [in]): 0.89 – 1.14 [0.035 – 0.045]
• Spring Material: Beryllium Copper
• Contact Spring Plating: Tin Lead
• Contact Base Material: Beryllium Copper
• Insertion Method: Hand/Semi-Automatic
• Government/industry Qualification: No
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Application: Production
• Packaging Method: Loose Piece

4.
4.1.
4.2.
4.3.
4.4.
Rev B
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to
confirm corrective action is required before resubmittal.
Quality Conformance Inspection
The applicable quality inspection plan shall specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
Specimen Selection
Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. All test groups shall each consist of a minimum of 32
specimens.
Test Sequence
Qualification inspection shall be verified by testing specimens as specified in Figure 2.
Low level Contact Resistance Measurement Points
Figure 3
108-1979
5 of 5