HA1-4902-2 Intersil, HA1-4902-2 Datasheet - Page 2

• Manufacturer Part Number: HA1-4902-2
• Description: IC COMPARATOR QUAD PREC 16-DIP
• Manufacturer: Intersil
• Type: General Purposer

Specifications of HA1-4902-2

• Number Of Elements: 4
• Output Type: CMOS, Push-Pull
• Voltage - Supply: 5 V ~ 15 V, ±2.5 V ~ 7.5 V
• Mounting Type: Through Hole
• Package / Case: 16-CDIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Absolute Maximum Ratings
Supply Voltage (Between V+ and V- Terminals) . . . . . . . . . . . . 33V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15V
Voltage Between V
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Power Dissipation (Notes 1, 2)
Operating Conditions
Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
Electrical Specifications
INPUT CHARACTERISTICS
Offset Voltage (Note 4)
Offset Current
Bias Current (Note 5)
Input Sensitivity (Note 6)
Common Mode Range
Differential Input Resistance
TRANSFER CHARACTERISTICS
Large Signal Voltage Gain
Response Time (t
(Note 7)
Response Time (t
(Note 7)
1. Maximum power dissipation, including output load, must be designed to maintain the junction temperature below 175
2. Total Power Dissipation (T.P.D.) is the sum of individual dissipation contributions of V+, V- and V
3. θ
HA-4900-2, HA-4902-2. . . . . . . . . . . . . . . . . . . . . -55
HA-4905-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
and below 150
vs Supply Voltages (see Performance Curves). The calculated T.P.D. is then located on the graph of Maximum Allowable Package Dissipation
vs Ambient Temperature to determine ambient temperature operating limits imposed by the calculated T.P.D. (See Performance Curves). For
instance, the combination of +15V, -15V, +5V, 0V (V+, V-, V
0V gives a T.P.D. of 450mW.
JA
is measured with the component mounted on an evaluation PC board in free air.
PARAMETER
PD
PD
LOGIC
o
C for plastic packages.
(0))
(1))
+ and V
LOGIC
2
V
TEMP
SUPPLY
(
Full
Full
Full
Full
Full
o
25
25
25
25
25
25
25
25
-. . . . . . . . . . . . . . . . . . .18V
C)
= ±15V, V
MIN
HA-4900, HA-4902, HA-4905
V-
-
-
-
-
-
-
-
-
-
-
-
-
-55
LOGIC
o
HA-4900-2
C to 125
o
o
C to 75
C to 125
TYP
250
400
130
180
10
50
2
-
-
-
-
-
-
+ = 5V, V
LOGIC
o
o
C
C
o
C
V
V
(V+) -
MAX
150
200
215
0.3
0.4
2.4
25
35
75
IO
IO
LOGIC
3
4
-
+, V
-
+
+
LOGIC
- = GND
Thermal Information
Thermal Resistance (Typical, Note 3)
Maximum Junction Temperature (Ceramic Package) . . . . . . .175
Maximum Junction Temperature (Plastic Package) . . . . . . . . .150
Maximum Storage Temperature Range . . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
Die Characteristics
MIN
CERDIP Package. . . . . . . . . . . . . . . . .
PDIP Package . . . . . . . . . . . . . . . . . . .
SOIC Package . . . . . . . . . . . . . . . . . . .
(SOIC - Lead Tips Only)
Back Side Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V-
Number of Transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Die Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 mils x 105 mils
V-
-
-
-
-
-
-
-
-
-
-
-
-
-) gives a T.P.D. of 350mW, the combination +15V, -15V, +15V,
-55
HA-4902-2
o
C to 125
TYP
250
400
130
180
10
50
2
-
-
-
-
-
-
o
C
V
V
(V+) -
MAX
150
200
200
215
0.5
0.6
2.6
IO
IO
35
45
5
8
LOGIC
-
-
+
+
shown in curves of Power Dissipation
MIN
V-
-
-
-
-
-
-
-
-
-
-
-
-
0
HA-4905-5
o
C to 75
TYP
250
400
100
130
180
25
4
o
-
-
-
-
-
-
θ
C for ceramic packages,
JA
o
100
(
85
90
C
o
C/W) θ
V
V
(V+) -
MAX
150
300
200
215
7.5
0.5
0.7
2.4
IO
IO
10
50
70
-
-
+
+
o
C to 150
JC
UNITS
N/A
N/A
kV/V
(
25
MΩ
mV
mV
mV
mV
nA
nA
nA
nA
o
ns
ns
V
C/W)
o
o
o
o
C
C
C
C