LM2901VNG ON Semiconductor, LM2901VNG Datasheet - Page 10

IC COMP QUAD SGL SUPPLY 14DIP

LM2901VNG

Manufacturer Part Number
LM2901VNG
Description
IC COMP QUAD SGL SUPPLY 14DIP
Manufacturer
ON Semiconductor
Type
General Purposer
Datasheet

Specifications of LM2901VNG

Number Of Elements
4
Output Type
CMOS, Open-Collector, TTL
Voltage - Supply
3 V ~ 36 V, ±1.5 V ~ 18 V
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Number Of Channels
4 Channels
Response Time
1.3 us
Offset Voltage (max)
7 mV
Input Bias Current (max)
250 nA
Supply Voltage (max)
36 V
Supply Voltage (min)
3 V
Supply Current (max)
2 mA
Maximum Power Dissipation
1000 mW
Maximum Operating Temperature
+ 105 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
LM2901VNGOS
SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
0.58
T
14X
K
B
S
C
P
7 PL
A
S
0.25 (0.010)
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
R
http://onsemi.com
1
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE H
M
7.04
7X
B
10
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_

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