NCS2200AMUT1G ON Semiconductor, NCS2200AMUT1G Datasheet - Page 14

• Manufacturer Part Number: NCS2200AMUT1G
• Description: IC COMPARATOR LV 6-UDFN
• Manufacturer: ON Semiconductor
• Series: NCS2200r
• Type: General Purposer

Specifications of NCS2200AMUT1G

• Number Of Elements: 1
• Output Type: Complementary, Rail-to-Rail
• Voltage - Supply: 0.85 V ~ 6 V
• Mounting Type: Surface Mount
• Package / Case: 6-UFDFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NCS2200AMUT1G; NCS2200AMUT1GOSTR

2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
1
H
5
A
2
G
4
3
C
*For additional information on our Pb−Free strategy and soldering
B
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
SOT−23−5 / TSOP−5 / SC59−5
0.039
1.0
PACKAGE DIMENSIONS
C A B
0.037
0.95
SOLDERING FOOTPRINT*
PLASTIC PACKAGE
http://onsemi.com
CASE 483−02
SN SUFFIX
J
ISSUE H
K
0.074
14
1.9
DETAIL Z
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
inches
DIM
mm
A
B
C
D
G
H
K
M
J
L
S
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_