DS1315 Maxim, DS1315 Datasheet
DS1315
Available stocks
Related parts for DS1315
DS1315 Summary of contents
Page 1
... The watch operates in one of two formats: a 12-hour mode with an AM/PM indicator or a 24-hour mode. The nonvolatile controller supplies all the necessary support circuitry to convert a CMOS RAM to a nonvolatile memory. The DS1315 can be interfaced with either RAM or ROM without leaving gaps in memory. PIN CONFIGURATIONS 1 ...
Page 2
... SO (300 mils) 3 (300 mils (300 mils (300 mils (300 mils TOP MARK* DS1315 336 DS1315 336 DS1315 56 DS1315 56 DS1315E XXXX-336 DS1315E XXXX-336 DS1315E XXXX-336 DS1315E XXXX-56 DS1315E XXXX-56 DS1315E XXXX-56 DS1315 336 DS1315 336 DS1315 56 DS1315S 56 DS1315S 56 ...
Page 3
Figure 1. Block Diagram ...
Page 4
... Time Chip. A standard 32.768kHz quartz crystal can be directly connected to the DS1315 via pins 1 and 2 (X1, X2). The crystal selected for use should have a specified load capacitance (C on crystal selection and crystal layout considerations, refer to Application Note 58: Crystal Considerations with Maxim Real-Time Clocks (RTCs) ...
Page 5
Figure 2. Time Chip Comparison Register Definition Note: The pattern recognition in Hex is C5, 3A, A3, 5C, C5, 3A, A3, 5C. The odds of this pattern being accidentally duplicated and causing inadvertent entry to the Phantom Time Chip are ...
Page 6
... SRAM. The DS1315 also performs redundant battery control for high reliability. On power-fail, the battery with the highest voltage is automatically switched to V system, the unused battery input should be connected to ground. The DS1315 safeguards the Time Chip and RAM data by power-fail detection and write protection. Power-fail detection occurs when V DS1315 constantly monitors the V ...
Page 7
Figure 4. ROM/Time Chip Interface Time Chip Register Information Time Chip information is contained in eight registers of 8 bits, each of which is sequentially accessed 1 bit at a time after the 64-bit pattern recognition sequence has been completed. ...
Page 8
Zero Bits Registers and 6 contain 1 or more bits that will always read logic 0. When writing these locations, either a logic acceptable. Figure 5. Time Chip Register Definition 8 ...
Page 9
... Lead Temperature (soldering, 10s) This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. RECOMMENDED OPERATING CONDITIONS (T = Over the operating range ...
Page 10
DC POWER-DOWN ELECTRICAL CHARACTERISTICS (V < 4.5V Over the operating range PARAMETER Output Voltage CEO Battery BAT1 BAT2 Current Battery Backup Current @ -0.2V CCO BAT AC ELECTRICAL OPERATING CHARACTERISTICS—ROM/ ...
Page 11
PARAMETER Write Cycle Pulse Width CEI Pulse Width OE Write Recovery Data Setup Data Hold Time Pulse Width RST DC OPERATING ELECTRICAL CHARACTERISTICS (V = 3.3V ±10 Over the operating range PARAMETER Average V Power-Supply CC ...
Page 12
AC ELECTRICAL OPERATING CHARACTERISTICS—ROM 3.3V ±10 Over the operating range PARAMETER Read Cycle Time Access Time CEI Access Time OE to Output Low-Z CEI to Output Low Output High-Z CEI to Output ...
Page 13
AC ELECTRICAL OPERATING CHARACTERISTICS—ROM 3.3V ±10 Over the operating range PARAMETER Read Cycle Time Access Time CEI Access Time OE to Output Low-Z CEI to Output Low Output High-Z CEI to Output ...
Page 14
Figure 6. Timing Diagram: Read Cycle to Time Chip ROM/ RAM = GND Figure 7. Timing Diagram: Write Cycle to Time Chip ROM/ RAM = GND ...
Page 15
Figure 8. Timing Diagram: Read Cycle to Time Chip ROM/ RAM = V Figure 9. Timing Diagram: Write Cycle to Time Chip ROM/ RAM = CCO CCO ...
Page 16
Figure 10. Timing Diagram: Reset Pulse RST 5V DEVICE POWER-UP/POWER-DOWN CHARACTERISTICS— ROM GND RAM CCO (T = 0°C to +70°C) A PARAMETER Recovery Time at Power-Up V Slew Rate CC Power-Down V (max (min) PF ...
Page 17
Figure 12. 5V Power-Down Condition 3.3V DEVICE POWER-UP POWER-DOWN CHARACTERISTICS— ROM GND RAM CCO (T = 0°C to +70°C) A PARAMETER Recovery Time at Power-Up V Slew Rate CC Power-Down V (max (min ...
Page 18
... Applies to with the ROM/ CEO will low level as V CEO the maximum average load current that the DS1315 can supply to memory in the battery CCO2 backup mode. 10) Applies to all input pins except 11) See Figures 11 and 12. 12) See Figures 13 and 14. ...
Page 19
Figure 14. 3.3V Power-Down Condition Figure 15. Output Load ...
Page 20
... SO (300 mil) PACKAGE INFORMATION For the latest package outline information and land patterns (footprints www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. ...
Page 21
... © 2011 Maxim Integrated Products DESCRIPTION Maxim is a registered trademark of Maxim Integrated Products, Inc DS1315 Phantom Time Chip PAGES CHANGED ...