78M6612 Maxim, 78M6612 Datasheet
78M6612
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78M6612 Summary of contents
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... DS_6612_001 DESCRIPTION The Teridian™ 78M6612 is a highly integrated, single-phase, power and energy measurement and monitoring system-on- chip (SoC) that includes a 32-bit compute engine (CE), an MPU core, RTC, and flash. ® Technology with a 22-bit delta-sigma ADC, four analog inputs, digital temperature compensation, and precision ...
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... Data Sheet 1 Hardware Description .................................................................................................................... 7 1.1 Hardware Overview................................................................................................................. 7 1.2 Analog Front End (AFE) .......................................................................................................... 8 1.2.1 Input Multiplexer .......................................................................................................... 8 1.2.2 A/D Converter (ADC) ................................................................................................... 9 1.2.3 FIR Filter ..................................................................................................................... 9 1.2.4 Voltage References ..................................................................................................... 9 1.2.5 Temperature Sensor.................................................................................................... 9 1.2.6 Battery Monitor ............................................................................................................ 9 1.3 Digital Computation Engine (CE) ........................................................................................... 10 1.3.1 Real-Time Monitor ..................................................................................................... 10 1.3.2 Pulse Generator ........................................................................................................ 10 1.3.3 Data RAM (XRAM) .................................................................................................... 10 1.4 80515 MPU Core .................................................................................................................. 11 1.4.1 UARTs ...................................................................................................................... 11 1.5 On-Chip Resources............................................................................................................... 11 1.5.1 Oscillator ................................................................................................................... 11 1 ...
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... Recommended PCB Land Pattern for the LQFP-64 Package..................................... 38 5.2 68-Pin QFN Package ............................................................................................................ 39 5.2.1 Pinout........................................................................................................................ 39 5.2.2 Package Outline ........................................................................................................ 40 5.2.3 Recommended PCB Land Pattern for the QFN-68 Package ...................................... 41 6 Pin Descriptions .......................................................................................................................... 42 6.1 Power/Ground Pins ............................................................................................................... 42 6.2 Analog Pins........................................................................................................................... 42 6.3 Digital Pins ............................................................................................................................ 43 7 I/O Equivalent Circuits ................................................................................................................. 44 8 Ordering Information ................................................................................................................... 45 9 Contact Information ..................................................................................................................... 45 Revision History .................................................................................................................................. 46 Rev 2 78M6612 Data Sheet 3 ...
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... Data Sheet Figures Figure 1: IC Functional Block Diagram ..................................................................................................... 6 Figure 2: AFE Block Diagram ................................................................................................................... 8 Figure 3: Connecting an External Load to DIO Pins ............................................................................... 15 Figure 4: Functions Defined by V1 ......................................................................................................... 17 Figure 5: Voltage, Current, Momentary and Accumulated Energy ........................................................... 18 Figure 6: MPU/CE Data Flow ................................................................................................................. 19 Figure 7: MPU/CE Communication ........................................................................................................ 20 Figure 8: Resistive Voltage Divider ........................................................................................................ 21 Figure 9: Resistive Current Shunt ...
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... Table 20: UART1 Interface Performance Specifications ......................................................................... 34 Table 21: Temperature Sensor Performance Specifications ................................................................... 34 Table 22: RAM and Flash Memory Specifications .................................................................................. 35 Table 23: Flash Memory Timing Specifications ...................................................................................... 35 Table 24: EEPROM Interface Timing ..................................................................................................... 35 Table 25: RESET and V1 Timing ........................................................................................................... 35 Table 26: RTC Range ............................................................................................................................ 35 Table 27: Power/Ground Pins ................................................................................................................ 42 Table 28: Analog Pins ............................................................................................................................ 42 Rev 2 78M6612 Data Sheet 5 ...
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... Data Sheet IA VA VBIAS MUX IB VB VBAT VREF TEMP VREF_CAL MUX VREF_DIS MUX CROSS CTRL EQU CK32 MUX_ALT CHOP_E MUX_DIV OSC RTCLK (32KHz) XIN (32KHz) XOUT CKTEST/ SEG19 4.9MHz CKOUT_E CK_GEN CK_2X ECK_DIS MPU_DIV MUX_SYNC CKCE <4.9MHz TEST TEST MODE ...
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... MPU, processed further, and output using the peripheral devices available to the MPU. In addition to advanced measurement functions, the real time clock function allows the 78M6612 to record time of use (TOU) measurement information for multi-rate applications and to time-stamp events. ...
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... Data Sheet 1.2 Analog Front End (AFE) The AFE functions as a data acquisition system, controlled by the MPU. It consists of an input multiplexer, a delta-sigma A/D converter, and a voltage reference. The main signals (IA, VA, IB, VB) are sampled and the ADC counts obtained are stored in CE DRAM where they can be accessed by the CE and, if necessary, by the MPU ...
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... DS_6612_001 1.2.2 A/D Converter (ADC) A single delta-sigma A/D converter digitizes the voltage and current inputs to the 78M6612. The resolution of the ADC is configurable to either bit. At the end of each ADC conversion, the FIR filter output data is stored into the CE RAM location. 1.2.3 FIR Filter The finite impulse response filter is an integral part of the ADC and it is optimized for use with the multiplexer ...
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... Data Sheet 1.3 Digital Computation Engine (CE) The CE, a dedicated 32-bit signal processor, performs the precision computations necessary to accurately measure energy. The CE calculations and processes include: • Multiplication of each current sample with its associated voltage sample to obtain the energy per sample (when multiplied with the constant sample time). ...
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... ANSI “C” 80515 application program library is available to help reduce design cycle. 1.4.1 UARTs The 78M6612 includes two UARTs (UART0 and UART1) that can be programmed to communicate with a variety of external devices. The UARTs are dedicated 2-wire serial interfaces, which can communicate at rates up to 38,400 bits/s. All UART transfers are programmable for parity enable, parity, 2 stop bits/1 stop bit and XON/XOFF option for variable communication baud rates from 300 to 38,400 bps ...
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... Compensation). 1.5.5 Flash Memory The 78M6612 includes on-chip Flash memory. The Flash memory primarily contains MPU and CE program code. It also contains images of the CE DRAM, MPU RAM, and I/O RAM. On power-up, before enabling the CE, the MPU copies these images to their respective locations. ...
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... DIO pin through its associated bit in its DIO_DIR register. Tables showing the relationship between LCD_NUM and the available segment/DIO pins can be found in Section 3.5 Connecting LCDs and in Rev 2 Section 4.3 I/O Description under LCD_NUM[4:0]. 78M6612 Data Sheet Table 2 lists the Table 3 shows the con- 13 ...
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... Data Sheet Table 2: Data/Direction Registers and Internal Resources for DIO Pin Groups DIO x – Pin no. (64 LQFP) – Pin no. (68 QFN) – Data Register – Direction Register Internal Resources – Configurable DIO 16 Pin no. (64 LQFP) 22 Pin no. (68 QFN Data Register ...
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... Not recommended Figure 3: Connecting an External Load to DIO Pins Rev 2 Table 3: DIO_DIR Control Bit DIO_DIR [n] 0 Input Table 78M6612 3.3V 3. LED LE D 78M6612 Data Sheet 1 Output Figure 3, left). This is due 4. If more than one input is V3P3SYS V3P3SYS VBA VBA T T V3P3D V3P3 D DIO1 ...
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... LCD and SLEEP modes, even if their pin is not configured as SEG. In this case, they can be useful as general- purpose non-volatile storage. 1.5.9 EEPROM Interface The 78M6612 provides hardware support for an optional two-pin or a three-wire ( interface. Two-Pin EEPROM Interface The dedicated 2-pin serial interface communicates with external EEPROM devices. The interface is multiplexed onto the DIO4 (SCK) and DIO5 (SDA) pins. Three-Wire (µ ...
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... V1 power fault detection. Since there is no method in firmware to disable the crystal oscillator or the WDT guaranteed that whatever state the part might find itself in, upon WDT overflow, the part will be reset to a known state. Figure 4: Functions Defined by V1 78M6612 Data Sheet 17 ...
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... For some applications, not only voltage and current amplitudes, but also phase angles and harmonic content may change constantly. Thus, simple RMS measurements are inherently inaccurate. A modern solid-state electricity measurement IC such as the 78M6612 functions by emulating the integral operation above, i.e. it processes current and voltage samples through an ADC at a constant frequency. As long ...
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... Power Fault Circuit The 78M6612 includes a comparator to monitor system power fault conditions. When the output of the comparator falls (V1<VBIAS), the PLL status bits in the I/O RAM are zeroed and the IC power downs. Once system power returns, the MPU remains in reset and does not start until 2048 to 4096 CK32 clock cycles later ...
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... Data Sheet 2.4 CE/MPU Communication Figure 7 shows the functional relationship between the CE and the MPU. The CE is controlled by the MPU via shared registers in the I/O RAM and RAM. The CE outputs two interrupt signals to the MPU to indicate the CE is actively processing data and the CE is updating data to the output region of the RAM. ...
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... Connection of Sensors (CT, Resistive Shunt) Figure 8, Figure 9, and Figure 10 current transformers are connected to the voltage and current inputs of the 78M6612. Rev 2 show how resistive voltage dividers, resistive current shunts, and Figure 8: Resistive Voltage Divider Figure 9: Resistive Current Shunt Figure 10: Current Transformer 78M6612 Data Sheet ...
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... Data Sheet 3.2 Connecting 5 V Devices All digital input pins of the 78M6612 are compatible with external 5 V devices. I/O pins configured as inputs do not require current-limiting resistors when they are connected to external 5 V devices. 3.3 Temperature Measurement Measurement of absolute temperature uses the on-chip temperature sensor and applying the following formula: In the above formula the temperature in ° ...
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... DS_6612_001 3.5 Connecting LCDs The 78M6612 has an on-chip LCD controller capable of controlling static or multiplexed LCDs. shows the basic connection for an LCD. 78M6612 The LCD segment pins can be organized in the following groups: • Seventeen pins are dedicated LCD segment pins (SEG0 to SEG13, SEG16 to SEG18). ...
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... Data Sheet 3.7 Connecting Three-Wire EEPROMs µWire EEPROMs and other compatible devices should be connected to the DIO pins DIO4 and DIO5, as shown in Figure 13 and described below: • DIO5 connects to both the DI and DO pins of the three-wire device. • The CS pin must be connected to a vacant DIO pin of the 78M6618. ...
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... Figure 15: Voltage Divider for V1 Figure 78M6612 V3P3D RESE T 10k Ω 10k Ω DGN DGN D D 78M6612 Data Sheet Figure 15). V1 must 16, left side. The RESET signal may be Figure 16, right 78M6612 RESET 100 Ω 100 ...
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... Data Sheet 3.11 Connecting the Emulator Port Pins Even when the emulator is not used, small shunt capacitors to ground (22 pF) should be used for protection from EMI as illustrated in to ground. V3P3D V3P3D 62 Ω 62 Ω 62 Ω 62 Ω Figure 17: External Components for the Emulator Interface 3 ...
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... DS_6612_001 3.15 Measurement Calibration Once the 78M6612 energy measurement device has been installed in a measurement system typically calibrated. A complete calibration includes the following: • Calibration of the metrology section, i.e. calibration for tolerances of the current sensors, voltage dividers and signal conditioning components as well as of the internal reference voltage (VREF). ...
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... Data Sheet 4 Electrical Specifications 4.1 Absolute Maximum Ratings Table 5 shows the absolute maximum ranges for the device. Stresses beyond Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation at these or any other conditions beyond those indicated under recommended operating ...
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... Load capacitor for crystal (exact value depends on crystal specifications and parasitic capacitance of board). Condition Normal Operation Battery Backup No Battery Battery Backup BRN and LCD modes SLEEP mode 78M6612 Data Sheet Value Unit ≥0.1±20% µF 0.1±20% µF ≥1.0±30% µF 0.1±20% µ ...
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... Data Sheet 4.4 Performance Specifications 4.4.1 Input Logic Levels Parameter Digital high-level input voltage † Digital low-level input voltage Input pull-up current E_RXTX, E_RST, CKTEST Other digital inputs Input pull down current ICE_E Other digital inputs † In battery powered modes, digital inputs should be below 0 above 2 minimize battery current ...
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... CE_E=0, ADC_E=0 VBAT=3.6V BROWNOUT mode, <25°C BROWNOUT mode, <>5°C LCD Mode, 25 °C LCD mode, over temperature SLEEP Mode, 25 °C Sleep mode, over temperature Condition | I | ≤ V3P3D | I | ≤ V3P3D 78M6612 Data Sheet Min Typ Max Unit kΩ -5.4 µV -6.0 -4.9 -2.6 -2.0 µ ...
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... Data Sheet 4.4.7 2.5V Voltage Regulator Unless otherwise specified, load = 5 mA. Table 14: 2.5 V Voltage Regulator Performance Specifications Parameter Voltage overhead V3P3-V2P5 PSSR ∆V2P5/∆V3P3 4.4.8 Low Power Voltage Regulator Unless otherwise specified, V3P3SYS=V3P3A=0. Table 15: Low-Power Voltage Regulator Performance Specifications Parameter V2P5 V2P5 load regulation VBAT voltage requirement PSRR Δ ...
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... T − -40ºC to +85º ºC (-1 -40 º ºC (-4%) Condition With respect to VLCD With respect to 2*VLC2/3 With respect to VLC2/2 With respect to VLC2/3 With respect to VLC2/2 78M6612 Data Sheet Min Typ Max Unit 1.195 1.197 2.5 kΩ ...
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... Data Sheet 4.4.12 ADC Converter, V3P3A Referenced FIR_LEN=0, VREF_DIS=0, LSB values do not include the 9-bit left shift at CE input. Table 19: ADC Converter Performance Specifications Parameter Recommended Input Range (Vin-V3P3A) Voltage to Current Crosstalk: 6 Vcrosstalk 10 * cos( ∠ Vin − ∠ Vcrosstalk Vin THD (First 10 harmonics) ...
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... Table 24: EEPROM Interface Timing Condition CKMPU=4.9152 MHz, Using interrupts CKMPU=4.9152 MHz, “bit-banging” DIO4/5 CKMPU=4.9152 MHz Table 25: RESET and V1 Timing Condition +100 mv overdrive Table 26: RTC Range Condition 78M6612 Data Sheet Min Typ Max Unit 5 Cycles 2 Cycles 1 Cycles 30 100 ...
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... Data Sheet 5 Packaging 5.1 64-Pin LQFP Package 5.1.1 Pinout GNDD 1 E_RXTX/SEG38 2 TX1/DIO2 3 TMUXOUT 4 TX0 5 SEG3 6 V3P3D 7 SEG19/CKTEST 8 V3P3SYS 9 SEG4 10 SEG5 11 SEG37/DIO17 12 COM0 13 COM1 14 COM2 15 COM3 16 36 TERIDIAN 78M6612-IGT Figure 18: 64-Pin LQFP Pinout DS_6612_001 RESET 48 V2P5 47 46 VBAT 45 RX0 44 SEG40/DIO20 SEG31/DIO11 43 SEG30/DIO10 42 SEG29/DIO9 ...
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... DS_6612_001 5.1.2 Package Outline (LQFP 64) 11.7 12.3 PIN No. 1 Indicator 0.60 Typ. : Controlling dimensions are in mm. NOTE Rev 2 11.7 12.3 9.8 10.2 0.14 0.50 Typ. 0.28 78M6612 Data Sheet 0.00 0.20 1.40 1.60 37 ...
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... Data Sheet 5.1.3 Recommended PCB Land Pattern for the LQFP-64 Package x y Recommended PCB Land Pattern Dimensions Symbol Note: The y dimension has been elongated to allow for hand soldering and reworking. Production assembly may allow this dimension to be reduced as long as the G dimension is maintained. ...
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... V3P3D 8 CKTEST/SEG19 9 V3P3SYS 10 SEG4 11 SEG5 12 SEG37/DIO17 13 COM0 14 COM1 15 COM2 16 COM3 Rev 2 TERIDIAN 78M6612-IM Figure 19: 68-Pin QFN Pinout 78M6612 Data Sheet RESET 51 V2P5 50 VBAT 49 RX0 48 SEG40/DIO20 47 SEG31/DIO11 46 SEG30/DIO10 45 SEG29/DIO9 44 SEG28/DIO8 43 SEG27/DIO7 42 SEG26/DIO6 41 SEG25/DIO5 40 ...
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... Data Sheet 5.2.2 Package Outline 0.850 Dimensions (in mm): *) Pin length is nominally 0.4 mm (min. 0.3 mm, max 0.4 mm). **) Exposed pad is internally connected to GNDD. 40 DS_6612_001 Rev 2 ...
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... Note 3: The y dimension has been elongated to allow for hand soldering and reworking. Production assembly may allow this dimension to be reduced as long as the G dimension is maintained. Rev 2 Recommended PCB Land Pattern Dimensions Description Lead pitch x Pad width y Pad length. See Note 3. See Note 1. 78M6612 Data Sheet Typical Dimension 0.4 mm 0.23 mm 0.8 mm 6.3 mm 6. ...
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... Data Sheet 6 Pin Descriptions 6.1 Power/Ground Pins Name Type Circuit GNDA P – GNDD P – V3P3A P – V3P3SYS P – V3P3D O 13 VBAT P 12 V2P5 O 10 6.2 Analog Pins Name Type Circuit IA VA VREF O 9 XIN I 8 XOUT Pin types Power Output Input, I/O = Input/Output ...
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... GNDD. To reset the chip, this pin should be pulled high. No external reset circuitry is necessary. Direct connect to ground in normal operation. UART input. If unused, this pin must be terminated to V3P3D or GNDD. UART output. Enables Production Test. Must be grounded in normal operation. 78M6612 Data Sheet 43 ...
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... Data Sheet 7 I/O Equivalent Circuits V3P3D V3P3D 110K Digital CMOS Input Input Pin GNDD Digital Input Equivalent Circuit Type 1: Standard Digital Input or pin configured as DIO Input with Internal Pull-Up V3P3D Digital CMOS Input Input Pin 110K GNDD GNDD Digital Input Type 2: ...
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... Bulk *Programmed, 32KB Tape & Reel 32KB Bulk 32KB Tape & Reel *Programmed, 32KB Bulk *Programmed, 32KB Tape & Reel 78M6612 Data Sheet Package Ordering Number Marking 78M6612-IGT/F 78M6612-IGT 78M6612-IGTR/F 78M6612-IGT 78M6612-IGT/F/P 78M6612-IGT 78M6612-IGTR/F/P 78M6612-IGT 78M6612-IM/F 78M6612-IM 78M6612-IMR/F 78M6612-IM ...
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... Data Sheet Revision History REVISION DATE First publication. 1.0 4/1/2009 Moved firmware specific information to respective developers manuals. Added Caution to duplex operation, TX interrupts may be inadvertently cleared and thus a TX safety timer is recommended.” 1.3 5/7/2010 Added Caution to In Section TX1E”. In Figure Added Maxim logo. ...