LM2901DG ON Semiconductor, LM2901DG Datasheet - Page 10
LM2901DG
Manufacturer Part Number
LM2901DG
Description
IC COMP QUAD SGL SUPPLY 14SOIC
Manufacturer
ON Semiconductor
Type
General Purposer
Datasheet
1.LM239NG.pdf
(12 pages)
Specifications of LM2901DG
Number Of Elements
4
Output Type
CMOS, Open-Collector, TTL
Voltage - Supply
3 V ~ 36 V, ±1.5 V ~ 18 V
Mounting Type
Surface Mount
Package / Case
14-SOIC (0.154", 3.90mm Width)
Package
14SOIC
Typical Response Time
1.3 us
Typical Response Time Range
0.5 to 5 us
Typical Voltage Gain Range
90 to 110 dB
Number Of Channels Per Chip
4
Minimum Single Supply Voltage
3 V
Power Supply Type
Single|Dual
Number Of Channels
4 Channels
Response Time
1.3 us
Offset Voltage (max)
7 mV
Input Bias Current (max)
250 nA
Supply Voltage (max)
36 V
Supply Voltage (min)
3 V
Supply Current (max)
2 mA
Maximum Power Dissipation
1000 mW
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Comparator Type
General Purpose
No. Of Comparators
4
Ic Output Type
CMOS, TTL
Supply Current
1mA
Supply Voltage Range
3V To 36V
Amplifier Case Style
SOIC
Rohs Compliant
Yes
Number Of Elements
4
Technology
Bipolar
Input Offset Voltage
7mV
Input Bias Current (typ)
250nA
Single Supply Voltage (typ)
5/9/12/15/18/24/28V
Dual Supply Voltage (typ)
±3/±5/±9/±12/±15V
Power Supply Requirement
Single/Dual
Voltage Gain In Db
100dB
Single Supply Voltage (min)
3V
Single Supply Voltage (max)
36V
Dual Supply Voltage (min)
±1.5V
Dual Supply Voltage (max)
±18V
Power Dissipation
1W
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
14
Package Type
SOIC
Output Compatibility
CMOS, TTL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
LM2901DG
LM2901DGOS
LM2901DGOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LM2901DG
Manufacturer:
ON
Quantity:
3 500
Part Number:
LM2901DG
Manufacturer:
ON/安森美
Quantity:
20 000
SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
0.58
T
14X
K
B
S
C
P
7 PL
A
S
0.25 (0.010)
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
R
http://onsemi.com
1
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE H
M
7.04
7X
B
10
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_