MAX11500USA+T Maxim Integrated Products, MAX11500USA+T Datasheet - Page 6

IC HD VIDEO FILTER 3CH 8-SOIC

MAX11500USA+T

Manufacturer Part Number
MAX11500USA+T
Description
IC HD VIDEO FILTER 3CH 8-SOIC
Manufacturer
Maxim Integrated Products
Type
Video Filterr
Datasheet

Specifications of MAX11500USA+T

Applications
DVD, HD, Set-Top Boxes, Recorders
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Three-Channel, High-Definition Video Filter
The MAX11500 features output buffers with +6dB gain
that drive a standard 150Ω video load. A typical load
consists of a 75Ω backmatch resistor, an optional
220µF or larger coupling capacitor, and a 75Ω termina-
tion resistor. The offset between input and output sig-
nals has been chosen such that the blanking level on
the output is less than 1V after the backmatch resistor,
thus meeting digital TV specifications. This allows the
MAX11500 to drive video loads directly without using
costly AC-coupling capacitors.
The MAX11500 outputs can be DC- or AC-coupled.
The MAX11500, with +6dB gain, is typically connected
to a 75Ω series backmatch resistor followed by the
video cable. If an AC connection is used, choose an
AC-coupling capacitor value that ensures that the low-
est frequency content in the video signal is passed and
the field-time distortion is kept within desired limits. The
selection of this value is a function of the input imped-
ance and more importantly the input leakage of the cir-
cuit being driven. Common industry practice is to use a
220µF or larger capacitor.
6
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Applications Information
Output Considerations
Output Buffer
The outputs of the MAX11500 are fully protected
against a short circuit either to the ground or the posi-
tive supply of the device. The short-circuit protection
circuitry limits the output current to typically 75mA per
output. Shorting more than one output simultaneously
may exceed the maximum package power dissipation.
The device is thermally designed to operate with mini-
mum copper. However, to help with heat dissipation,
connect the power and ground traces to large copper
areas if possible. Bypass V
capacitor and an additional 1µF capacitor in parallel for
additional low-frequency decoupling. Using surface-
mount capacitors reduces lead inductance and
ensures that the impedance of the capacitors is low
over a broad range of frequencies.
Place traces carrying video signals appropriately to
avoid mutual coupling. If AC-coupling the inputs, place
the input coupling capacitors as close as possible to
the device and keep traces short to minimize parasitic
capacitance and inductance. Doing so extends the
performance to the uppermost frequency range possi-
ble with the MAX11500.
For a recommended PCB layout, refer to the MAX11500
EV kit data sheet.
PCB Layout Recommendations
CC
to GND with a 0.1µF

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