MAX14759 Maxim, MAX14759 Datasheet - Page 2

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MAX14759

Manufacturer Part Number
MAX14759
Description
The MAX14759/MAX14761/MAX14763 analog switches are capable of passing bipolar signals that are beyond their supply rails
Manufacturer
Maxim
Datasheet
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND, unless otherwise noted.)
V
EN, EN1, EN2, SEL ............................... -0.3V to + (V
A, B, A1, A2, B1, B2, COM .................... (V
V
V
V
Continuous Current Through Switch (MAX14759) ........ Q500mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
8-Pin TDFN
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
ELECTRICAL CHARACTERISTICS
(V
DC CHARACTERISTICS
Power Supply Range
Continuous Current Through
Switch
Supply Current
Analog-Signal Range
On-Resistance
On-Resistance Flatness
A, A1, A2 Off-Leakage Current
COM, B, B1, B2 Off-Leakage
Current
CC
P
N
P
CC
Junction-to-Ambient Thermal Resistance (q
Junction-to-Case Thermal Resistance (q
.................................................................... -0.3V to Lesser of
........................Greater of (V
to V
..........................................................................-0.3V to +6V
= +3.0V to +5.5V, T
N
................................................................. -0.3V to +70V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
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A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC
- 40V) or (V
I
Low On-Resistance Analog Switches
SYMBOL
COM(OFF)
V
(V
I
I
V
A_(OFF)
B_(OFF)
A_
DR
P
V
R
COM
I
I
CC
A_
CC
, V
ON
+ 0.3V) or (V
ON
N
(+52V) or (V
JC
B_
- 0.3V) to Lesser of
,
) .................8°C/W
JA
P
,
MAX14759/MAX14761/MAX14763
- 70V) to +0.3V
) ..........48°C/W
(MAX14759)
(MAX14761/MAX14763)
V
V
Switch open or closed
I
I
(MAX14761/MAX14763)
-25V < V
-25V < V
(MAX14761/MAX14763)
V
V
(MAX14761/MAX14763)
V
(MAX14759/MAX14763)
V
B
COM
CC
CC
A
A_
COM
B_
= Q500mA, V
CC
= +25V, V
= +25V, V
= 15V, V
≤ 4.7V
> 4.7V
N
N
or I
or V
+ 0.3V)
+ 52V)
+ 70V)
A
A_
B_
< +25V, I
B
< +25V, I
= Q250mA, V
Above- and Below-the-Rails
= 15V, V
A_
B
COM
= 0V, Figure 1 (MAX14759)
A
= 0V, Figure 1 (MAX14761)
CONDITIONS
= Q25V (MAX14759)
B
or V
Continuous Current Through Switch
Continuous Power Dissipation (T
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +160NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
10-Pin TDFN
B_
A_
= Q500mA (MAX14759)
(MAX14761, MAX14763) ........................................... Q250mA
8-Pin TDFN Package
(derate 24.4mW/NC above +70NC) .........................1951.2mW
10-Pin TDFN Package
(derate 24.4mW/NC above +70NC) .........................1951.2mW
Junction-to-Ambient Thermal Resistance (q
Junction-to-Case Thermal Resistance (q
V
V
V
V
B_
or I
= 0V, Figure 1
EN_
EN_
EN_
EN_
A
= 0V, Figure 1
_ = Q25V
COM
= V
= V
= V
= V
= Q250mA
CC
CC
CC
CC
/2
/2
CC
= 5V and T
-500
-250
-250
-250
-100
-100
MIN
3.0
-25
A
= +70NC)
A
TYP
4.1
4.1
2.5
2.5
0.6
1.2
2.4
5.1
= +25°C.) (Note 2)
JC
) .................9°C/W
JA
) ..........41°C/W
+500
+250
+250
+250
+100
+100
MAX
+25
5.5
10
10
6
6
1
2
UNITS
mI
mA
mA
nA
nA
I
V
V

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