MAX4731 Maxim, MAX4731 Datasheet - Page 2

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MAX4731

Manufacturer Part Number
MAX4731
Description
The MAX4731/MAX4732/MAX4733 low-voltage, dual, single-pole/single-throw (SPST) analog switches operate from a single +2V to +11V supply and handle rail-to- rail analog signals
Manufacturer
Maxim
Datasheet

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ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
V+ ...........................................................................-0.3V to +12V
IN_, COM_, NO_, NC_ (Note 1)....................-0.3V to (V+ + 0.3V)
Continuous Current (any pin) ...........................................±10mA
Peak Current (any pin, pulsed at 1ms, 10% duty cycle) ...±20mA
Continuous Power Dissipation (T
50
ELECTRICAL CHARACTERISTICS—Single +3V Supply
(V+ = +3V ±10%, V
(Notes 3, 4)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Note 1: Signals on IN_, NO_, NC_, or COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
ANALOG SWITCH
Analog Signal Range
On-Resistance
On-Resistance Matching
Between Channels (Notes 5, 6)
On-Resistance Flatness
(Note 7)
NO_ or NC_ Off-Leakage Current
(Note 8)
COM_ Off-Leakage Current
(Note 8)
COM_ On-Leakage Current
(Note 8)
8-Pin µMAX (derate 4.5mW/°C above +70°C) .............362mW
8-Pin TDFN (derate 24.4mW/°C above +70°C) .........1951mW
9-Bump UCSP (derate 4.7mW/°C above +70°C).........379mW
_______________________________________________________________________________________
maximum current rating.
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Pre-
heating is required. Hand or wave soldering is not allowed.
PARAMETER
Dual SPST Analog Switches in UCSP
IH
= +2.0V, V
A
IL
= +70°C)
= +0.8V, T
V
I
R
I
SYMBOL
COM_(OFF)
I
I
NO_
COM_(ON)
NO_(OFF)
NC_(OFF)
V
FLAT(ON)
∆R
COM_
R
ON
, V
ON
NC_
,
A
= T
V+ = +2.7V,
I
V
V+ = +2.7V,
I
V
V+ = +2.7V,
I
V
V+ = +3.6V,
V
V
V+ = +3.6V,
V
V
V+ = +3.6V,
V
V
floating
COM_
COM_
COM_
MIN
NO_
NO_
NO_
COM_
NO_
COM_
NO_
COM_
NO_
to T
or V
or V
or V
or V
or V
or V
= 5mA;
= 5mA;
= 5mA;
= +0.3V, +3V;
= +0.3V, +3V;
= +0.3V, +3.0V;
MAX
NC_
NC_
NC_
NC_
NC_
NC_
CONDITIONS
, unless otherwise noted. Typical values are at V+ = +3V, T
= +1.5V
= +1.5V
= +1V, +1.5V, +2V
= +3V, +0.3V
= +3V, +0.3V
= +0.3V, +3V, or
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Maximum Junction Temperature .....................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering, Note 2)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
T
T
T
T
T
T
+25°C
+25°C
+25°C
+25°C
+25°C
+25°C
T
T
T
T
T
T
MIN
MIN
MIN
MIN
MIN
MIN
T
MAX
MAX
MAX
MAX
MAX
MAX
A
to
to
to
to
to
to
MIN
-0.1
-0.1
-0.2
-2
-2
-4
0
TYP
0.8
2.3
19
MAX
+0.1
+0.1
+0.2
3.5
4.5
V+
+2
+2
+4
50
60
11
9
A
= +25°C.)
UNITS
nA
nA
nA
V

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