TSG12832L TEAM SOURCE DISPLAY, TSG12832L Datasheet - Page 12
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TSG12832L
Manufacturer Part Number
TSG12832L
Description
Manufacturer
TEAM SOURCE DISPLAY
Datasheet
1.TSG12832L.pdf
(14 pages)
Specifications of TSG12832L
Display Format
128 x 32
Control/driver
ST7565R
Outline Dimension
35.0 x17.9 x 1.8MAX.
V.a.(mm)
32.0 x 10.0
Supply Voltage
3.0V
Interface Mode
Parallel / Serial
Moq
10K
Team Source Display
12) Defect of land surface
5. Inspection Standards
Item
1) Display on inspection
2) Black/White spot
3) Black/White line
4) Display pattern
5) Spot-like contrast
irregularity
6) Bubbles in polarizer
7) Scratches and dent on the
polarizer
8) Stains on the surface of
9) Rainbow color
10) Viewing area
11) Bezel appearance
13) Parts mounting
14) Part alignment
15) Conductive foreign
16) Bezel flaw
17) Indication on name plate
(sampling indication label)
www.tslcd.com
LCD panel
contact
matter (solder ball,
encroachment
solder hips)
(1) Non display
(3) Horizontal line is deficient (4) Cross line is deficient
Length (mm)
Defects separate with each other at an interval of more than 20mm
Note: 1) Up to 3 damages acceptable
Note: 1) Conformed to limit samples.
Scratches and dent on the polarizer shall be in the accordance with “2)
Black/white spot”, and “3) Black/White line”.
Stains which cannot be removed even when wiped lightly
with a soft cloth or similar cleaning.
No rainbow color is allowed in the optimum contrast on state within the active
area.
Polarizer edge or line is visible in the opening viewing area due to polarizer
shortness or sealing line.
Rust and deep damages that are visible in the bezel are rejected.
Evident crevices that are visible are rejected.
(1) Failure to mount parts
(2) Parts not in the specifications are mounted
(3) For example: Polarity is reversed, HSC or TCP falls off.
(1) LSI, IC lead width is more than 50% beyond pad outline.
(2) More than 50% of LSI, IC leads is off the pad outline.
(1) 0.45<Φ, N≥1
(2) 0.3<Φ≤0.45, N≥1, Φ: Average diameter of solder ball (unit: mm)
(3) 0.5<L, N≥1, L: Average length of solder chip (unit: mm)
(1) Failure to stamp or label error, or not legible.(all acceptable if legible)
(2) The separation is more than 1/3 for indication discoloration, in which the
A+B≤0.28 0<C D+E≤0.25
5.0≤L≤10 0.03<W≤0.04
5.0≤L≤10 0.04<W≤0.05
1.0≤L≤10 0.05<W≤0.06
1.0≤L≤10 0.06<W≤0.08
Bezel claw missing or not bent
characters can be checked.
2
2) Not allowed if there are two or more pinholes every three-fourth inch.
2) Intervals of defects are more than 30mm.
L≤10
L≤10 0.08<W
Size Φ(mm)
Φ≤0.3
0.3<Φ≤0.45
0.45<Φ≤0.6
0.6<Φ
Size Φ(mm)
0.65<Φ≤1.2
0.7<Φ≤1.0
1.0<Φ≤1.5
1.5<Φ
Size Φ(mm)
0.4<Φ≤0.65
1.2<Φ
Width (mm)
Φ≤0.7
Φ≤0.4
W≤0.03
2
Criterion for defects
(2) Vertical line is deficient
Acceptable number
Acceptable Number
Acceptable number
Ignore (note)
Ignore (note)
3
1
Acceptable Number
Ignore (note)
0
follows 2) point defect
0
3
1
1
F+G≤0.25
2
0
Ignore
2
3
2
2
1
LCM Specification
Defect type
Minor
Major
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor