M74VHC1GT50DFT1G ON Semiconductor, M74VHC1GT50DFT1G Datasheet - Page 6

• Manufacturer Part Number: M74VHC1GT50DFT1G
• Description: IC BUFF CMOS LVL/SFTR N-I SOT353
• Manufacturer: ON Semiconductor
• Series: 74VHCr

Specifications of M74VHC1GT50DFT1G

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
• Logic Family: 74VHC
• Number Of Channels Per Chip: Single
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 8 mA
• Input Bias Current (max): 1 uA
• Low Level Output Current: 8 mA
• Maximum Power Dissipation: 200 mW
• Minimum Operating Temperature: - 55 C
• Number Of Lines (input / Output): 3
• Propagation Delay Time: 19.5 ns @ 2.5 or 13.5 ns @ 3.3 V or 7.7 ns @ 5 V
• Circuit Type: High Speed
• Current, Supply: 40 μA
• Function Type: 1-Channel
• Logic Function: Buffer
• Number Of Circuits: Single
• Package Type: SC-88A/SOT353/SC-70
• Special Features: Non-Inverting
• Temperature, Operating, Range: -55 to +125 °C
• Voltage, Supply: 1.65 to 5.5 V
• Logic Device Type: Buffer, Non Inverting
• Supply Voltage Range: 1.65V To 5.5V
• Logic Case Style: SOT-353
• No. Of Pins: 5
• Operating Temperature Range: -55°C To +125°C
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Family Type: VHC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: M74VHC1GT50DFT1GOS; M74VHC1GT50DFT1GOS; M74VHC1GT50DFT1GOSTR; MC74VHC1GT50DFT1G; MC74VHC1GT50DFT1GOS; MC74VHC1GT50DFT1GOS

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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2X
2X
0.10
0.20
NOTE 5
0.05
L
T
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
1.0
C A B
0.037
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
MC74VHC1GT50
http://onsemi.com
J
CASE 483−02
K
ISSUE G
TSOP−5
0.074
1.9
DETAIL Z
6
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
M
A
B
C
D
G
H
K
S
J
L
mm
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_
MC74VHC1GT50/D