LT1082CTPBF LINEAR TECH, LT1082CTPBF Datasheet - Page 11

• Manufacturer Part Number: LT1082CTPBF
• Manufacturer: LINEAR TECH

PACKAGE DESCRIPTIO
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
(1.524)
.060
HATCHED AREA IS SOLDER PLATED
(7.620 – 8.255)
(0.229 – 0.381)
BOTTOM VIEW OF DD PAK
0.300 – 0.325
0.009 – 0.015
0.325
8.255
COPPER HEAT SINK
+0.889
–0.381
+0.035
–0.015
(6.502)
(7.620)
.256
.300
(1.524)
(1.905)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
.075
.060
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN INCH/(MILLIMETER)
2. DRAWING NOT TO SCALE
(4.648)
.183
(1.651)
0.065
.067
TYP
U
.420
(1.524)
.060
TYP
(8.382 – 9.398)
0.100
(2.54)
3.632
BSC
.330 – .370
(1.143 – 1.651)
.143
0.045 – 0.065
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1461)
(Reference LTC DWG # 05-08-1510)
+0.305
–0.508
+.012
–.020
5-Lead Plastic DD Pak
.042
.090
.350
N8 Package
Q Package
.565
(0.711 – 0.965)
(0.457 0.076)
.028 – .038
0.018 0.003
TYP
(3.302 0.127)
0.130 0.005
.080
(3.175)
0.125
MIN
(9.906 – 10.541)
FOR THICKER SOLDER PASTE APPLICATIONS
.205
.390 – .415
.320
(1.702)
RECOMMENDED SOLDER PAD LAYOUT
.067
BSC
15 TYP
(0.508)
0.020
MIN
.067
.420
.276
(6.477 0.381)
0.255 0.015*
(4.191 – 4.572)
.165 – .180
(0.330 – 0.584)
.013 – .023
(1.499)
.059
TYP
.042
.090
.325
8
1
.565
2
(10.160)
7
0.400*
MAX
(1.143 – 1.397)
0.102
.045 – .055
(2.413 – 2.921)
.004
(1.270 0.305)
.095 – .115
6
3
.050 .012
+0.203
–0.102
+.008
–.004
Q(DD5) 0502
5
4
N8 1098
LT1082
sn1082 1082fas
11