MC74HC244ADWG ON Semiconductor, MC74HC244ADWG Datasheet
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MC74HC244ADWG
Specifications of MC74HC244ADWG
MC74HC244ADWGOS
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MC74HC244ADWG Summary of contents
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... Chip Complexity: 136 FETs or 34 Equivalent Gates • Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 20 PDIP−20 ...
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... high impedance ORDERING INFORMATION Device MC74HC244AN MC74HC244ANG MC74HC244ADW MC74HC244ADWG MC74HC244ADWR2 MC74HC244ADWR2G MC74HC244ADT MC74HC244ADTG MC74HC244ADTR2 MC74HC244ADTR2G MC74HC244AF MC74HC244AFG MC74HC244AFEL MC74HC244AFELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ...
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... Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Î Î Î Î ...
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... NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). C Power Dissipation Capacitance (Per Buffer Used to determine the no−load dynamic power consumption Semiconductor High−Speed CMOS Data Book (DL129/D DATA INPUT 90% 50% ...
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SEATING PLANE 0.25 (0.010 20X 0. 18X A1 MC74HC244A PACKAGE DIMENSIONS PDIP−20 N SUFFIX PLASTIC ...