IR3081AMTR International Rectifier, IR3081AMTR Datasheet - Page 20

• Manufacturer Part Number: IR3081AMTR
• Description: XPHASE VR 10.0 Control IC. The Control IC combined with an IR XPhase TM Phase IC provides a full featured and flexible way to implement a complete VR 10.0 power solution.
• Manufacturer: International Rectifier

Specifications of IR3081AMTR

• Package: 28-Lead MLPQ
• Circuit: X-Phase Controller IC
• Switch Freq (khz): 150kHz to 1.0MHz
• Pbf: PbF Option Available

Over Current Setting Resistor R
The inductor DC resistance is utilized to sense the inductor current. The copper wire of inductor has a constant
temperature coefficient of 3850 ppm/°C, and therefore the maximum inductor DCR can be calculated from Equation
(8), where R
T_
The current sense amplifier gain of IR3086A decreases with temperature at the rate of 1470 ppm/°C, which
compensates part of the inductor DCR increase. The phase IC die temperature is only a couple of degrees Celsius
higher than the PCB temperature due to the low thermal impedance of MLPQ package. The minimum current sense
amplifier gain at the maximum phase IC temperature T
The total input offset voltage (V
(V
sense resistors R
The over current limit is set by the external resistor R
over current limit. I
and is determined by the curve in Figure 14. K
phase and is calculated from Equation (12).
No Load Output Voltage Setting Resistor R
A resistor between FB pin and the converter output is used to create output voltage offset V
difference between V
lowers the converter voltage by R
R
adaptive voltage positioning resistor R
are determined by (13) and (14) respectively.
Body Braking
The body braking
enabled, Resistors R
Dynamic VID step down. Usually R
FB
CS_OFST)
ROOM
Page 20 of 39
is not only determined by I
respectively.
of the amplifier itself and that created by the amplifier input bias currents flowing through the current
L_MAX
TM
CS+
Related Resistors R
TM
OCSET,
V
and R
R
K
R
R
G
R
CS
OCSET
FB
DRP
during Dynamic VID can be disabled by connecting BBFB pin to ground. If the feature is
and R
P
L
BBFB
CS
DAC
_
_
=
_
TOFST
=
MAX
=
MIN
(
V
L_ROOM
R
the bias current of OCSET pin, changes with switching frequency setting resistor R
=
voltage and output voltage at no load condition. Adaptive voltage positioning further
I
R
CS-
L
and R
=
[
−
FB
_
=
I
=
V
MAX
R
LIMIT
.
G
O
V
FB
∗
n
L
CS
CS
)
_
R
O
∗
, the current flowing out of FB pin as shown in Figure 14, but also affected by the
CS_TOFST
OCSET
∗
ROOM
BBDRP
L
_
are the inductor DCR at maximum temperature T
*I
_
V
BBFB
V
∗
_
ROOM
OFST
n
O
O,
O
MAX
R
I
∗
O
/(
_
L
DRP
BBFB
where R
R
I
L
NLOFST
_
/
∗
FB
and R
+
O
MAX
n
∗
1 [
∗
∗
are needed to restore the feedback voltage of the error amplifier after
I
V
G
1 [
∗
+
CSIN
and total input offset voltage of current sense amplifiers. R
) of current sense amplifier in phase ICs is the sum of input offset
I
CS
and R
R
−
∗
3850
∗
FB
−
L
1470
1 (
_
BBDRP
+
f
O
_
SW
MIN
P
V
+
∗
MAX
and Adaptive Voltage Positioning Resistor R
CS
is the required output impedance of the converter.
*
R
is the ratio of inductor peak current over average current in each
K
∗
BBDRP
*
CS
10
_
P
) 2
10
TOFST
)
+
are chosen to match R
−
OCSET
+
6
IC_MAX
−
−
V
6
∗
I
CS
∗
CSIN
(
∗
T
(
_
T
L
n
TOFST
as defined in Equation (11), where I
_
IC
−
∗
MAX
is calculated from Equation (9).
∗
_
R
MAX
R
O
CS
]
∗
−
−
G
T
−
CS
ROOM
T
ROOM
_
MIN
)]
)]
/
FB
I
OCSET
and R
DRP
L_MAX
respectively
(10)
(11)
(12)
(13)
(14)
and room temperature
(8)
(9)
O_NLOFST,
LIMIT
DRP
IR3081A
1/31
.
is the required
FB
/05
which is the
and R
OSC
DRP