MC74HC125ANG ON Semiconductor, MC74HC125ANG Datasheet - Page 8
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MC74HC125ANG
Manufacturer Part Number
MC74HC125ANG
Description
IC BUFFER TRI-ST QD N-INV 14DIP
Manufacturer
ON Semiconductor
Series
74HCr
Datasheet
1.MC74HC125ANG.pdf
(9 pages)
Specifications of MC74HC125ANG
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
4
Number Of Bits Per Element
1
Current - Output High, Low
7.8mA, 7.8mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Logic Family
HC
Number Of Channels Per Chip
4
Polarity
Non-Inverting
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
High Level Output Current
- 7.8 mA
Low Level Output Current
7.8 mA
Maximum Power Dissipation
750 mW
Minimum Operating Temperature
- 55 C
Number Of Lines (input / Output)
4 / 3
Output Type
3-State
Propagation Delay Time
90 ns at 2 V, 36 ns at 3 V, 18 ns at 4.5 V, 15 ns at 6 V
Logical Function
Buffer/Line Driver
Number Of Elements
4
Number Of Channels
4
Number Of Inputs
4
Number Of Outputs
4
Operating Supply Voltage (typ)
2.5/3.3/5V
Package Type
PDIP
Operating Supply Voltage (max)
6V
Operating Supply Voltage (min)
2V
Quiescent Current
4uA
Technology
CMOS
Pin Count
14
Mounting
Through Hole
Operating Temp Range
-55C to 125C
Operating Temperature Classification
Military
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
2V To 6V
Logic Case Style
DIP
No. Of Pins
14
Operating Temperature Range
-55°C To +125°C
Filter Terminals
DIP
Rohs Compliant
Yes
Family Type
HC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC74HC125ANGOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC74HC125ANG
Manufacturer:
ON Semiconductor
Quantity:
480
−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
A
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
K
0.10 (0.004)
REF
8
7
SOLDERING FOOTPRINT*
M
−U−
PACKAGE DIMENSIONS
1
B
T
H
1.26
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
8
SECTION N−N
Ç Ç Ç
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
0.65
PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10 0.193
4.50 0.169
1.20
0.15 0.002
0.75 0.020
0.60 0.020
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
8
_
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_