SLE 66R35 Infineon Technologies, SLE 66R35 Datasheet - Page 4

• Manufacturer Part Number: SLE 66R35
• Manufacturer: Infineon Technologies

Specifications of SLE 66R35

• Interface: ISO / IEC 14443 Type A
• Eeprom: 1,024.0 Byte
• Security Features: 4-byte UID, mutual three pass authentication with 48-bit keys
• Delivery Forms: Wafer, NiAu-bump, MCC2, MCC8
• Typical Application: Transport, Access Control

1 Ordering and Packaging information
Table 1
Type
SLE 66R35 C
SLE 66R35 NB
SLE 66R35 MCC2
SLE 66R35 MCC8
SLE 66R35I C
SLE 66R35I NB
SLE 66R35I MCC2
SLE 66R35I MCC8
SLE 66R35R C
SLE 66R35R NB
SLE 66R35R MCC2
SLE 66R35R MCC8
For more ordering information (wafer thickness and height of NiAu-Bump) please contact your local Infineon sales office.
Figure 1
Figure 2
Figure 3
1)
2)
Preliminary Short Product Information
Available as a Module Contactless Card (MCC) for embedding in plastic cards, as NiAu-bump version (NB) or as a die on sawn /
unsawn wafer for customer packaging
Discontinued, consider to use successor products SLE 66R35I, SLE 66R35R or SLE 66R35E7
Ordering Information
Pin Configuration Module Contactless Card MCC2 (top view)
Pin Configuration Module Contactless Card MCC8-2-3 (top / bottom view)
Pin Configuration Module Contactless Card - MCC8-2-6 in (top / bottom view)
2)
2)
2)
2)
Package
Die (on Wafer)
Die (on Wafer)
P-MCC2-2-1
P-MCC8-2-3
Die (on Wafer)
Die (on Wafer)
P-MCC2-2-1
P-MCC8-2-6
Die (on Wafer)
Die (on Wafer)
P-MCC2-2-1
P-MCC8-2-6
1)
Remark
sawn / unsawn
NiAu-Bump, sawn
sawn / unsawn
NiAu-Bump, sawn
sawn / unsawn
NiAu-Bump, sawn
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SLE 66R35I, SLE 66R35R
Ordering Code
on request
on request
on request
on request
on request
on request
on request
on request
on request
on request
on request
on request
SLE 66R35
2011-03-10